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heavy copper pcb manufacturers

Heavy copper pcb manufacturers in China Heavy copper PCB manufacturers always called >3 oz thick copper pcb as heavy copper PCBs, There is really no set definition of what constitutes a Heavy Copper PCB. General,in the industry label PCBs with 3 or more ounces of copper on [...]

heavy copper pcb manufacturers <span class="sdata2" title="2018-01-01T16:27:21+00:00"></span>

Reasons of PCB Size Fluctuation and Corresponding Analysis

Reasons of PCB Size Fluctuation and Corresponding Analysis From the substrate once the inner layer of the line pattern transfer by several times until the outer layer of the lamination line graphics processing, will cause the puzzle warp and weft to different expansion. From the entire PCB production FLOW-CHART [...]

Reasons of PCB Size Fluctuation and Corresponding Analysis <span class="sdata2" title="2017-12-29T15:24:04+00:00"></span>

FR4 PCB Boards

            Features FR-4 epoxy fiberglass fabric plate, is a kind of substrate with epoxy resin as binder and electronic grade glass fiber cloth as reinforcing material. Its adhesive sheet and thin copper clad laminate are important substrates for making multilayer printed circuit boards. The [...]

FR4 PCB Boards <span class="sdata2" title="2017-12-28T10:58:37+00:00"></span>

PCB laminate production process

PCB laminate production process 1, Autoclave pressure cooker Is a container filled with high temperature saturated water vapor and high pressure. The laminated Laminates can be placed in it for a period of time to force moisture to enter the plate, and the plate removed Placed in a high [...]

PCB laminate production process <span class="sdata2" title="2017-12-28T10:37:21+00:00"></span>

PCB Assembly

PCB Assembly Single side SMT Process: Incoming inspection => silk screen solder paste (spot patch glue) => patch => drying (curing) => reflow => cleaning => inspection => Repair Double sides SMT Process: A: Incoming inspection => PCB of a screen printing solder paste (point patch glue) => SMD [...]

PCB Assembly <span class="sdata2" title="2017-12-25T14:40:23+00:00"></span>

Common Quality Problems of Soldering Process and Improvement Measures

Common Quality Problems of Soldering Process and Improvement Measures First, exposed copper cause: Clean room cleanliness did not meet the requirements Screen, film or exposure glass or Mylar debris Clean is not in place Improvements: WF screen printing room and exposure room shall reach 10,000, (1 cubic meter [...]

Common Quality Problems of Soldering Process and Improvement Measures <span class="sdata2" title="2017-12-25T14:19:29+00:00"></span>

Immersion Gold Rigid flex PCB

Immersion Gold Rigid flex PCB            The basic process of  Rigid flex PCB: 1 selection of materials 2 production process and key parts of the control 3 production process . 4 internal single chip graphics transfer 5Flexible material multilayer Positioning 6laminated 7 drilling 2. 8 to drill dirt, convex eclipse [...]

Immersion Gold Rigid flex PCB <span class="sdata2" title="2017-12-22T15:18:59+00:00"></span>

A comprehensive summary of common PCB board design methods and measures to anti-ESD

A comprehensive summary of common PCB board design methods and measures to anti-ESD 1, as much as possible the use of multi-layer PCB Compared to double-sided PCBs, the ground plane and power plane, as well as the closely spaced signal-to-ground spacing, reduce common mode impedance and inductive coupling to [...]

A comprehensive summary of common PCB board design methods and measures to anti-ESD <span class="sdata2" title="2017-12-22T14:47:45+00:00"></span>

              Unlike traditional FR-4 (plastic), ceramic materials have good high-frequency and electrical properties, and have high thermal conductivity, chemical stability and excellent thermal stability, such as organic substrates do not have the performance of a new generation of large scale integrated circuits and power electronic modules ideal packaging materials. [...]

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What are the factors that lead to PCB copper-throwing?

First, PCB factory process factors: 1, excessive copper etching, the market is generally used in electrolytic copper foil single-sided galvanized (commonly known as ash foil) and single-sided copper (commonly known as red foil), the common rejection of copper is generally 70um above the zinc-plated copper Foil, red foil and [...]

What are the factors that lead to PCB copper-throwing? <span class="sdata2" title="2017-12-21T14:21:49+00:00"></span>

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