PCB Capability 
ItemDescription Capability
Layer countGeneral2-50
HDI High Density Interconnect3+N+3
Impedance ControlledToleranceMin.+/-5%, General+/-10%
Impedance TestedYes,100%
MaterialFR-4, Fr-5,High TgYES
RogersYES
ArlonYES
TaconicYES
TeflonYES
F4BYES
Halogen FreeYES
Lines/spacesMinimum3/3m mil (0.075/0.075mm)
DrillingCNC Machine Drill0.15mm(6 mil)
Laser Drilling0.1mm(4 mil)
Board thicknessMaximum6.0mm(236mil)
Aspect Ration16:1
Panel sizeMaximum600x800(mm)
Copper thicknessExternal Cu Thickness 0.5 OZ - 40 OZ ( 17um - 1400 um)
Internal Cu Thickness 0.5OZ - 6OZ ( 17um - 210um)
Solder maskColorGreen, Blue, White, Black, Red, etc.
Min Solder mask Bridge2mil(0.050mm)
Plugged Hole Diameter8mil-20mil ( 0.20mm-0.50mm)
Final finishingHASL Lead FreeYes
HASLYes
ENIGYes,(Gold 1 U" - 10 U")
OSPYes
Immersion SilverYes
Immersion TinYES
Plat hard Gold FingerYES,10 U" - 30 U"
ProfileCNC Routing Tolerance General +/-0.13MM(5mil)
CNC Routing Tolerance Min.+/-0.1mm(4mil)
V-scoring+/-0.1mm, 15 30 45 60 Deg.
Beveling30 45 Deg.
Sink HoleYES
CertificationUL RoHS ISO9001 SGSYES
Inspect StandardIPC 6012B Class 2YES
IPC 6012B Class 3YES
FileGerber Protel DXPAvalible
Auto CAD PADS OrCAD Express PCB etcAvalible