PCB stack up
Sometime we called PCB stack up as pcb structure.
It is very important for multilayer pcb impedance control.
A typical PCB stackup is constructed from multiple alternating layers of core,
prepreg, and copper foil materials heat-pressed and glued together.
Layer stack-up specifies the proper arrangement of circuit board layers for
Multilayer pcb boards before starting board layout design. Stack-up mainly
defines which layers should be solid power and ground planes,
the substrate (dielectric constant), and the spacing between layers.
While planning a layer stack-up, also compute the desired trace dimension
And minimum trace spacing.
General 4 Layers pcb stack up:
General 6 Layers pcb stack up:
General 8 Layers pcb stack up:
Prepreg thickness of raw material ( ITEQ ShengYi ):
Core of PCB material: