Circuit board plate blister is actually a bad board adhesion problem, and then extended is the surface quality of the board, which contains two aspects: Board cleanliness problem; Surface roughness (or surface energy) problem. All boards on the board surface foam problems can be summarized as the above [...]
Due to various reasons, more or less will result in the quality of nickel coating failure, such as the appropriate remedial measures can be taken to reduce unnecessary rework. In addition to polishing on polished and burr-free coatings, it is also common to refill parts that are not polished [...]
Equipment types In the printed circuit board production process, the main use of electroplating equipment, there are two, one is the horizontal plating line, one is vertical plating line. These two different structure of the electroplating equipment, mainly the circuit board delivery in different ways, the use of the [...]
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