The difference between the gold plate and the gold plate in the circuit board

First, why use gold plate With the increasing integration of ICs, the more IC pins are denser. The vertical spray process is difficult to flatten the fine lands, which makes it difficult to mount the SMT. In addition, the shelf life of the spray tin plate is very short. [...]

The difference between the gold plate and the gold plate in the circuit board

Copper sink quality control method

Copper sink quality control method Electroless Plating Copper is commonly referred to as sink copper. Printed circuit board hole metallization technology is one of the key technologies of printed circuit board manufacturing technology. Strictly controlling the quality of the hole metallization is the prerequisite for ensuring the quality of [...]

Copper sink quality control method

PCB basics

Printed circuit boards (PCBs) appear in almost every type of electronic device. If there are electronic parts in a certain device, they are also mounted on PCBs of different sizes. In addition to fixing a variety of small parts, the main function of the PCB is to provide the [...]

PCB basics

FPC board composition material introduction

FPC board composition material introduction 1、Insulating substrate The insulating substrate is a flexible insulating film. As the insulation carrier of FPC flexible circuit board, the choice of flexible dielectric film requires a comprehensive inspection of the material's heat resistance, shape, thickness, mechanical properties and electrical properties. Polyimide films, polyester [...]

FPC board composition material introduction

Strengthening of FPC Reinforcement Plates

Strengthening of FPC Reinforcement Plates Special handling of FPC soft board reinforcement The special design can make the reinforcement not only play the function of the component support, but also can be designed as an auxiliary component device so that the FPC soft board can be assembled into a [...]

Strengthening of FPC Reinforcement Plates

PCB design tips switching power supply

In any switching power supply design, the physical design of the PCB is the last link. If the design method is improper, the PCB may radiate too much electromagnetic interference, causing the power supply to be unstable. The following steps are performed for each step. analysis. Design flow from [...]

PCB design tips switching power supply

Common Quality Problems and Solutions in PCB Solder Masking Process

Common Quality Problems and Solutions in PCB Solder Masking Process Everyone in PCB design knows that solder mask is a layer of ink printed on the PCB surface. It not only plays the role of insulation, but also protects the copper surface. It also plays a beautiful and beautiful [...]

Common Quality Problems and Solutions in PCB Solder Masking Process

Introduction of Standards Used in Printed Circuit Boards

Introduction of Standards Used in Printed Circuit Boards 1) IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Includes the design, setup, implementation, and maintenance of the ESD control program. According to the historical experience of certain military organizations and business organizations, it provides guidance for the [...]

Introduction of Standards Used in Printed Circuit Boards

The meaning of layers in the PCB

1. What is the meaning of each layer in the PCB? Mechanical layer: defines the appearance of the entire PCB board, that is, the overall structure of the PCB board. Keepoutlayer Disables the wiring layer: Defines the copper side of the cloth's electrical characteristics. That is to say, after [...]

The meaning of layers in the PCB

Affects the circuit board side etching factor

Affects the circuit board side etching factor Etching method: Soaking and bubbling etching will cause larger side etching, and splash and spray etching will reduce side etching, especially spray etching. The type of etching solution: Different etching solutions have different chemical compositions, the etching rate is different, and the [...]

Affects the circuit board side etching factor
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