Board source

The creator of the printed circuit board was the Austrian Paul Eisler. In 1936, he first used a printed circuit board on the radio. In 1943, Americans used the technology for military radio. In 1948, the United States officially recognized the invention for commercial use. Printed circuit boards have been widely used since the mid-1950s.

Prior to the advent of the PCB, the interconnection between the electronic components was done by direct connection of the wires. Today, wires are used only in laboratory applications; printed circuit boards are definitely in an absolute control position in the electronics industry.

PCB production process:

First, contact the manufacturer

First, you need to contact the manufacturer, then register the customer number, then someone will quote you, place an order, and follow up the production schedule. I know that there is a circuit board company whose speed and quality are both levers. You can go and see.

Second, the material

Purpose: According to the requirements of the engineering data MI, cut into small pieces on the large sheet that meets the requirements. Small pieces of a sheet that meet customer requirements.

Process: large sheet material → cutting board according to MI requirements → seesaw → beer fillet \ edging → exit board

Third, drilling

Purpose: According to the engineering data, the required aperture is drilled at the corresponding position on the sheet of the required size.

Process: stacking pin → upper plate → drilling → lower plate → inspection \ repair

Fourth, sinking copper

  1. Objective: The copper is deposited by chemically depositing a thin layer of copper on the walls of the insulating holes.

Process: rough grinding → hanging board → copper line automatic line → lower board → dip % dilute H2SO4 → thick copper

Five, graphics transfer

Purpose: the Graphic transfer is the transfer of images on the production film to the board

Process: (blue oil process): grinding board → printing the first side → drying → printing the second side → drying → explosion → shadowing → inspection; (dry film process): hemp board → laminating → standing → right Bit → Exposure → Rest → Shadow → Check

Sixth, graphic plating

Purpose: Graphic plating is to electroplate a layer of copper on the exposed copper skin or hole wall to the desired thickness of the copper layer and the desired thickness of gold or tin.

Process: upper plate → degreasing → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate

Seven, unwinding

  1. Objective: Retreat the anti-plating coating layer with a NaOH solution to expose the non-line copper layer.

Process: water film: inserting → soaking alkali → washing → scrubbing → passing machine; dry film: placing board → passing machine

Eight, etching

Purpose: Etching is the use of chemical reaction method to corrode the copper layer in non-line parts.

Nine, green oil

Purpose: Green oil transfers the pattern of a green oil film to the board to protect the line and prevent tin on the line when soldering parts.

Process: grinding plate → printing photosensitive green oil →  plate → exposure → shadow; grinding plate → printing the first side → baking sheet → printing the second side → baking sheet

Ten, characters

Purpose: Characters are provided as an easy-to-identify mark

Process: After the end of green oil → cool and cool → adjust the network → print characters → after

Eleven, gold-plated fingers

Purpose: Plating a nickel/gold layer of the required thickness on the plug finger to make it more wear resistant

Process: upper plate → degreasing → water washing twice → micro-etching → water washing twice → pickling → copper plating → water washing → nickel plating → water washing → gold plating

Tinplate (a process of juxtaposition)

Purpose: Spray tin is sprayed with a layer of lead-tin on the bare copper surface not covered with the solder resist oil to protect the copper surface from oxidation and oxidation to ensure good soldering performance.

Process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and drying

Twelve, molding

Purpose: Through the die stamping or CNC machine to cut out the shape forming method required by customers, organic enamel, beer board, handcuffs, hand cut

Note: The accuracy of the data board and the beer board is higher, the handcuffs are second, and the hand cutting board can only make some simple shapes.

Thirteen, testing

Objective: Through the electronic 100% test, it can detect the open circuit, short circuit and other defects that are not easily found by visual observation.

Process: upper mold → release board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap

Fourteen, final inspection

Purpose: Through 100% visual inspection of the appearance defects of the board, and repair of minor defects, to avoid problems and defective board outflow.

Specific workflow: incoming materials → view data → visual inspection → qualified → FQA random inspection → qualified → packaging → unqualified → processing → check OK

Alice Lu,

Email: sales16@andwinpcb.com

Skype: andwinpcb16@outlook.com

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