After the wiring design is completed, it is necessary to carefully check whether the wiring design meets the rules set by the designer, and also needs to confirm the formulation.
Whether the rules meet the requirements of the printed board production process, the general inspection has the following aspects:
Line and line, line and component pad, wire and through hole, component pad and through hole, the distance between through hole and through hole
Reasonable, whether it meets the production requirements.
Is the width of the power and ground wires appropriate, and is there a tight coupling between the power supply and the ground (low wave impedance)? Is it in the PCB?
There is also a place where the ground line can be widened.
Whether the best measures are taken for the key signal lines, such as the shortest length, the protection line, the input line, and the output line are obviously
Whether the analog circuit and the digital circuit part have separate ground lines.
Whether the graphics (such as icons, and markers) added to the PCB will cause a signal short circuit.
Modify some undesired lines.
Is there a process line on the PCB? Does the solder mask meet the requirements of the production process, and the solder resist size is appropriate? The character mark is
Will not be pressed on the device pad, so as not to affect the quality of the electrical equipment.
Whether the edge of the outer frame of the power supply layer in the multi-layer board is reduced, such as the copper foil of the power supply layer is exposed outside the board, which is likely to cause a short circuit.
The purpose of this document is to illustrate the flow of printed board design and some notes using PADS’ printed board design software PowerPCB.
The idea is to provide design specifications for the designers of a working group to facilitate communication and mutual inspection between designers.