Introduction of Standards Used in Printed Circuit Boards
1) IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Includes the design, setup, implementation, and maintenance of the ESD control program. According to the historical experience of certain military organizations and business organizations, it provides guidance for the handling and protection of ESD sensitive periods.
2) IPC-SA-61 A: Semi-aqueous cleaning manual after welding. Includes all aspects of semi-aqueous cleaning, including chemical, production residues, equipment, processes, process control, and environmental and safety considerations.
3) IPC-AC-62A: Handbook of water cleaning after welding. Describe the cost of manufacturing residues, types and properties of aqueous cleaners, cleaning processes, equipment and processes, quality control, environmental controls and employee safety, as well as the measurement and determination of cleanliness.
4) IPC-DRM -4 0E: Through Hole Solder Joint Evaluation Desk Reference Manual. Detailed descriptions of the components, the wall of the hole, and the coverage of the soldering surface are provided in accordance with the standard requirements, in addition to computer-generated 3D graphics. Covers tin filling, contact angles, tinning, vertical fills, pad overlays, and numerous solder joint defects.
5) IPC-TA-722: Welding Technology Evaluation Manual. Includes 45 articles on all aspects of welding technology, covering general welding, welding materials, hand welding, batch welding, wave soldering, reflow soldering, vapor phase soldering, and infrared soldering.
6) IPC-7525: Template Design Guidelines. Provides guidelines for the design and manufacture of solder paste and surface-mount adhesive-coated stencils i. Also discusses the use of surface mount technology for stencil design and describes the use of stencils with through-hole or flip-chip components. Technology, including overprinting, double printing, and staged template design.
7) IPC/EIA J-STD-004: Specification requirements for fluxes include Appendix I. Includes technical indicators and classifications for rosin, resins, etc., organic and inorganic fluxes classified according to the content and activation of halides in the flux; also includes the use of fluxes, flux-containing substances, and low levels used in no-clean processes Residue flux.
8) IPC/EIA J-STD-005: Specification requirements for solder paste include Appendix I. Lists solder paste characteristics and specifications requirements, as well as test methods and standards for metal content, as well as viscosity, break-down, solder balls, tack, and solder paste tinning performance.
9) IPC/EIA J-STD -0 06A: Specification requirements for electronic grade solder alloys, fluxes, and non-flux solid solders. For electronic grade solder alloys, rods, ribbons, powdered fluxes, and non-flux solders, for electronic solder applications, provide terminology naming, specification requirements, and test methods for special electronic grade solders.
10) IPC-Ca-821: General requirements for thermally conductive adhesives. This includes the need for and testing methods for thermally conductive dielectrics that bond components to a suitable location.
11) IPC-3406: Guidelines for the application of adhesives to conductive surfaces. It provides guidance on the choice of conductive adhesive as an alternative to solder in electronic manufacturing.
12) IPC-AJ-820: Assembly and Welding Manual. Contains a description of assembly and welding inspection techniques, including terms and definitions; printed circuit board, component and pin type, solder point material, component mounting, design specification reference and outline; soldering techniques and packaging; Cleaning and lamination; quality assurance and testing.
13) IPC-7530: Guide to the temperature profile of batch soldering processes (reflow soldering and wave soldering). Various test methods, techniques and methods are used in the acquisition of the temperature curve to provide guidance for the establishment of the best graphics.
14) IPC-TR-460A: Troubleshooting list for wave soldering of printed circuit boards. List of corrective actions recommended for possible failure due to wave soldering.
15) IPC/EIA/JEDEC J-STD-003A. Printed circuit board solderability test.
16) J-STD-0 13: Application of Ball Grid Array Package (SGA) and other high-density technologies. Establish specifications requirements and interactions for printed circuit board packaging processes to provide information for high-performance and high-pin-count integrated-circuit packaging interconnections, including design principle information, material selection, board fabrication and assembly techniques, and test methods And reliability expectations based on the end-use environment.
17) IPC-7095: Supplement to the design and assembly process of SGA devices. Provides a variety of useful operating information for people who are using SGA devices or are considering moving to the form of array packaging; providing guidance for SGA inspections and repairs and providing reliable information on the SGA field.
18) IPC-M-I08: Cleaning instruction manual. Includes the latest version of the IPC Cleaning Guide, which assists manufacturing engineers in determining the cleaning process and troubleshooting of products.
IPC-CH-65-A: Cleaning Guideline in Printed Circuit Board Assembly #e#19) IPC-CH-65-A: Guidelines for Cleaning in Printed Circuit Board Assembly. Provides references for current and emerging cleaning methods in the electronics industry, including descriptions and discussions of various cleaning methods, and explains the relationship between various materials, processes, and contaminants in manufacturing and assembly operations.
20) IPC-SC-60A: Cleaning manual for solvent after soldering. The use of solvent cleaning techniques in automatic and manual soldering is given, solvent properties, residues, and process control and environmental issues are discussed.
21) IPC-9201: Surface Insulation Resistance Manual. Contains terms, theory, test procedures, and test methods for surface insulation resistance (SIR), temperature, humidity (TH) testing, failure modes, and troubleshooting.
22) IPC-DRM-53: Introduction to the Electronic Assembly Desktop Reference Manual. Used to illustrate the illustration and photos of through hole mounting and surface mount assembly techniques.
23) IPC-M-103: Standard for surface mount assembly manuals. This section includes all 21 IPC files for surface mount.
24) IPC-M-I04: Printed Circuit Board Assembly Manual Standard. Contains the 10 most widely used documents on printed circuit board assembly.
25) IPC-CC-830B: Performance and qualification of electronic insulation compounds in printed circuit board assembly. The conformal coating meets an industry standard for quality and qualification.
26) IPC-S-816: Surface Mount Technology Process Guide and Checklist. The troubleshooting guide lists all types of process problems encountered in surface mount assembly and their solutions, including bridging, missing soldering, and misalignment of components.
27) IPC-CM-770D: Guidelines for Installation of Printed Circuit Board Components. Provides effective guidance for the preparation of components in printed circuit board assemblies, and reviews relevant standards, influence, and distribution, including assembly techniques (including manual and automatic and surface mount technologies and flip chip assembly techniques) And considerations for subsequent soldering, cleaning, and lamination processes.
28) IPC-7129: Calculation of DPMO per Million of Opportunities and Printed Circuit Board Assembly Manufacturing Specifications. A benchmark that is agreed upon by the defect and quality-related industrial sectors; it provides a satisfactory method for calculating the number of failures per million chances of benchmarking.
29) IPC-9261: Printed circuit board assembly production estimates and breakdowns per million opportunities during assembly. Defines a reliable method for calculating the number of failures per million chances during the assembly of a printed circuit board. It is a measure of the evaluation at each stage of the assembly process.
30) IPC-D-279: Reliable Surface Mount Technology Printed Circuit Board Assembly Design Guidelines. Printed circuit board reliability for surface mount technology and hybrid technology Manufacturing process guidelines, including design ideas.
31) IPC-2546: Combination requirements for transmission points in printed circuit board assembly. Material motion systems are described, such as actuators and bumpers, manual placement, automatic screen printing, automatic adhesive dispensing, automated surface placement, automated plated through hole placement, forced convection, infrared reflow ovens, and wave soldering.
32) IPC-PE-740A: Troubleshooting in the manufacture and assembly of printed circuit boards. Including case records and corrective actions in the design, manufacturing, assembly, and testing of printed circuit products.
33) IPC-6010: Printed Circuit Board Quality Standards and Performance Specifications Series Manual. Including the PCBA’s quality standards and performance specifications for all printed circuit boards.
34) IPC-6018A: Inspection and Testing of Microwave Finished Printed Circuit Boards. Includes high-frequency (microwave) printed circuit board performance and qualification requirements.
35) IPC-D-317A: Guidelines for the design of high-speed electronic packaging. Provides guidance for the design of high-speed circuits, including mechanical and electrical considerations and performance tests.
Grace Zheng
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