Introduction to FPC material Polyimide

Introduction to FPC material Polyimide

Introduction to Polyimide, a material for flexible boards:

(1) Polyimide has excellent heat dissipation performance and can withstand thermal shock during high temperature processing of lead-free soldering;

(2) For small devices that require more emphasis on signal integrity, most device manufacturers tend to use flexible circuits;

(3) Polyimide has high glass transition temperature and high melting point characteristics, and generally needs to be processed above 350 °C;

(4) In terms of organic dissolution, Polyimide is not dissolved in a general organic solvent.

Grace Zheng

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