Foreword: Many projects do not know the solder mask and the soldering layer. It is to open the window,
but only the paste layer, there is no solder layer, some board factories do not look at the paste layer (note that this is used)
Open the steel mesh), so it leads to the leakage of the window. Here is a brief introduction to their distinction.
Do not understand the consultation QQ 800058721, if there is something wrong, please point out and learn together.

The Solder layer is used to control the area where the green oil (white oil) is not covered when the board is made.
For example, the position of the pad, some key signal test points, and the green oil are not covered to leak the pad.
If you do not include the Solder layer at the pad location, the pad will be covered with green oil
and you will need to wear off the green oil (white oil) to solder.

The Paste layer is supplied to the plate making factory for the production of steel mesh. Wherever the Paste layer appears,
the steel mesh is perforated. That is to say, this layer is not used to control the PCB, but to control the opening of the stencil.
When the SMT patch is produced, these openings are used to brush the solder paste,
and the position of the solder paste (the solder paste). It happens to be the location of the pad.

 

Alice Lu,

Email: sales16@andwinpcb.com