Through Hole PCB Assembly On Sale – In China

We are writing to you today to discuss through hole assembly, a process that is essential

to the manufacturing of high- quality electronic products.

Through hole assembly is a method of mounting electronic components onto a printed

circuit board (PCB) by inserting the component leads into drilled holes on the board and

then soldering them in place.

This process is commonly used for components that require a strong mechanical bond

to the PCB, such as connectors,switches, and larger components like electrolytic capacitors

and power transistors.

Through hole assembly is also used for components that require a higher level of electrical

performance, such as high-frequency components like crystal oscillators and filters.

The through hole assembly process begins with the preparation of the PCB.

The board is first drilled with holes in the locations where the components will be mounted.

The holes are then plated with a conductive material, typically copper,

to create a connection between the component lead and the PCB trace.

Once the PCB is prepared, the components are inserted into the holes. The leads are then

bent to hold the component in place and to ensure that the leads are flush with the surface

of the PCB. The PCB is then flipped over, and the leads

are soldered to the PCB using a soldering iron or a wave soldering machine.


Through hole assembly has several advantages over other methods of mounting electronic

components, such as surface mount technology (SMT). One of the primary advantages is

that through hole assembly provides a stronger mechanical bond between the component

and the PCB.

This is particularly important for components that are subject to vibration or mechanical stress,

such as connectors and switches.

Through hole assembly also allows for larger components to be mounted on the PCB, which can

be important for high-power applications.

Additionally, through hole assembly can provide better electrical performance for certain

components, such as high-frequency components.

However, there are also some disadvantages to through hole assembly.

One of the main disadvantages is that it is a more time-consuming process than SMT.

This is because each component must be inserted and soldered individually,whereas with SMT,

components can be mounted using automated pick-and-place machines.

Another disadvantage is that through hole assembly can be more expensive than SMT,

particularly for small-scale production runs.

This is because the process requires more manual labor and specialized equipment.

Despite these disadvantages, through hole assembly remains an important process in the

manufacturing of electronic products.

It is particularly useful for components that require a strong mechanical bond or

a high level of electrical performance.

If you have any questions about through hole assembly or would like to learn more about our

manufacturing capabilities, please do not hesitate to contact us.

Thank you for your time and consideration.


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