Author: Grace

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Common quality problems and solutions of copper clad laminates
ByGrace December 30, 2024December 27, 2024
I. Resistance to diffuse soldering Dip soldering resistance is a common problem in China. It is also a process technology issue that many manufacturers pay great attention to. The performance reliability of electronic products depends to a large extent on the quality reliability of printed circuit boards. After the electrical components are inserted into the…
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3G network and PCB signal integrity issues
ByGrace December 30, 2024December 27, 2024
Signal integrity issues 1.Definition of signal integrity Signal integrity (SignalIntegrity) refers to a state in which the signal is not damaged. It indicates that the signal still maintains its correct functional characteristics after being transmitted through the signal line, and the signal can respond with the correct timing and voltage in the circuit. From the…
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Eight high-frequency PCB wiring design and skills
ByGrace December 28, 2024December 26, 2024
High-frequency circuits are often highly integrated and have high wiring density. The use of multi-layer boards is both necessary for wiring and an effective means to reduce interference. In the PCB Layout stage, the reasonable selection of the size of a certain number of printed circuit boards can make full use of the middle layer…
Read More Eight high-frequency PCB wiring design and skills
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The six skill of choose pcb component
ByGrace December 28, 2024December 26, 2024
Best Practices for PCB Design: Six Things to Consider When Selecting PCB Components Based on Component Packages. All of the examples in this article were developed using the Multisim design environment, but the same concepts apply even when using different EDA tools. 1.Consider Component Package Selection The component package and land pattern decisions that need…
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About the pros and cons of PCB copper coating
ByGrace December 28, 2024December 27, 2024
Copper coating is an important part of PCB design. Whether it is the domestic Qingyuefeng PCB design software or some foreign Protel and PowerPCB, they all provide intelligent copper coating function. So how to coat copper well? I will share some of my ideas with you, hoping to benefit my peers. The so-called copper coating…
Read More About the pros and cons of PCB copper coating
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Importance of impedance control
ByGrace December 28, 2024December 26, 2024
Impedance control is related to many factors, such as the characteristics of the PCB, where it is used, etc. If the PCB is designed for digital signals, it is generally differential impedance, which is different from the application of RF signals. However, in these two categories of applications, more subcategories can be subdivided for discussion….
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The skill and design of high frequency pcb wiring
ByGrace December 28, 2024December 26, 2024
PCB is also known as printed circuit board (Printed Circuit Board). It can realize the line connection and function realization between electronic components, and is also an important part of power circuit design. Today, this article will introduce the high-frequency circuit wiring skills in PCB design. Multilayer board wiring: High-frequency circuits are often highly integrated…
Read More The skill and design of high frequency pcb wiring
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What is an excellent PCB design?
ByGrace December 28, 2024December 26, 2024
What is an excellent PCB design? Let’s talk about the working methods and working habits during design, which will make your design more reasonable, easier to produce, and better in performance. 1 Production requirements The requirements for board material, board thickness, copper thickness, process, solder mask/character color, etc. are clear. The above requirements are the…
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How to design RF circuits and their PCB layout
ByGrace December 28, 2024December 26, 2024
This article interprets the four basic characteristics of RF circuits from four aspects: RF interface, small desired signal, large interference signal, and interference from adjacent channels, and gives important factors that need special attention in the PCB design process. RF interface of RF circuit simulation Conceptually, wireless transmitters and receivers can be divided into two…
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Several issues to consider when designing PCBs
ByGrace December 28, 2024December 26, 2024
With the vigorous development of the PCB industry, more and more engineering and technical personnel have joined the design and manufacture of PCBs. However, since PCB manufacturing involves many fields and a considerable number of PCB design engineers (Layout personnel) have not engaged in or participated in the production and manufacturing process of PCBs, the…
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How to make a good PCB board
ByGrace December 28, 2024December 26, 2024
Everyone knows that making a PCB board is to turn the designed schematic diagram into a real PCB circuit board. Please don’t underestimate this process. There are many things that work in principle but are difficult to achieve in engineering, or things that others can achieve but others can’t. Therefore, it is not difficult to…
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Experienced Engineer PCB Design Experience Introduction
ByGrace December 28, 2024December 26, 2024
As an electronic engineer, designing circuits is a necessary hard work. However, no matter how perfect the principle design is, if the circuit board design is unreasonable, the performance will be greatly reduced, and in serious cases, it may not work properly. Based on my experience, I have summarized the following points that should be…
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High-speed PCB design based on PROTEL
ByGrace December 28, 2024December 26, 2024
This paper discusses some layout and wiring related principles that need to be paid attention to in the process of using PROTEL design software to realize high-speed circuit printed circuit board design, and provides some practical and verified high-speed circuit layout and wiring technologies to improve the reliability and effectiveness of high-speed circuit board design….
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BGA package design and common defects
ByGrace December 28, 2024December 27, 2024
Correctly Design the BGA Package Ball Grid Array (BGA) is becoming a standard packaging form. People have seen significant results using BGAs with a pitch of 0.05 to 0.06 inches. The next step in packaging evolution is likely to be chip-scale packaging (CSP), which is smaller and easier to process. BGA design rules Bump slump…
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EMI solutions in multi-layer PCB design
ByGrace December 28, 2024December 26, 2024
There are many ways to solve EMI problems. Modern EMI suppression methods include: using EMI suppression coatings, selecting appropriate EMI suppression parts and components, and EMI simulation design. This article starts from the most basic PCB layout and discusses the role and design techniques of PCB layer stacking in controlling EMI radiation. Power bus Reasonably…
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