DBC Ceramic PCB

Andwin Circuits builds DBC (Direct Bonded Copper) ceramic PCBs — copper foil is directly bonded to Al2O3 or AIN ceramic under high temperature for excellent electrical isolation, thermal conductivity and current-carrying capacity.

DBC Ceramic PCB Capability

DBC Ceramic PCB

Direct Bonded Copper board

DBC Sample C110

Finished board

DBC Sample C113

Finished board

DBC Sample C114

Finished board.

DBC Sample C115

Finished board

DBC Sample C116

Finished board

Capability Parameters

Substrate material

Aluminum oxide Ceramic (Al2O3) 96% or 98%
Aluminum Nitride Ceramic ( AlN )

Max. board size

137 × 190 mm

Conductor

Copper

Ceramic thickness

0.38 | 0.50 | 0.635 | 0.76 | 1.0 | 1.5 | 2.0 mm

Copper thickness

Min. 105 µm ( 3 oz ), then 200 µm ( 0.2 mm ), 300 µm ( 0.3 mm ) or more

Min. trace space/width

0.2 / 0.2 mm ( 8 / 8 mil )

Why Choose DBC Ceramic PCB?

Excellent electrical isolation — ceramic substrate separates high-voltage copper layers reliably.

High thermal conductivity — heat leaves the chip straight through copper-bonded ceramic.

Fine solderability — copper surface takes standard soldering well.

High bonding strength — copper is directly bonded to ceramic, no adhesive to fail.

PCB-like structure / etched wiring — can be structured just like a PCB or get etched wiring.

High current loading capability — thick bonded copper carries high current with low loss.

Applications

High-power LED lighting fields where DTP MCPCB’s direct-bond cooling pays off .

IGBT module

Power semiconductor modules.

LED modules

High-power LED packages.

Solar cell

Photovoltaic electronics.

Electric power transmitter modules

Power conversion & transmission.

Sensor

Sensing electronics.

Frequently Asked Questions

1. What does DBC stand for?

DBC means Direct Bonded Copper — a technique where copper foil and Al2O3 or AIN ceramic (single or double sided) are directly bonded under high temperature, with no adhesive layer between them.

2. What ceramic materials are supported?

The source page lists Aluminum oxide Ceramic (Al2O3) 96% or 98% and Aluminum Nitride Ceramic (AIN) as the supported substrates.

3. What are the size and copper limits?

Max board size 137 × 190 mm; ceramic thickness from 0.38 to 2.0 mm; copper thickness min. 105 µm (3 oz) up to 200 / 300 µm or more; min. trace space/width 0.2 / 0.2 mm (8/8 mil).

4. Where are DBC ceramic PCBs used?

Per the source page: IGBT module, LED modules, Solar cell, Electric power transmitter modules, Sensor and other high temperature electronic products.

5. How do I get a quote?

Send your PCB Gerber file and/or BOM to sales@andwinpcb.com (priority). Our team will quote as soon as possible, or you can submit the on-page form and we will contact you.