DBC ceramic PCB

DBC is Direct Bonded Copper technique denotes a special process,
which the copper foil and the Al2O3 or AIN single or tow sided.
They are directly bonded under high temperature.

The finished supre-thin DBC substrate have excellent electrical isolation,
High thermal conductivity, fine solderability and high bonding strength.

It may be strunctured just like PCB or get etched wiring,
And has high currenct loading capability.

DBC ceramic PCB capability

• Aluminum oxide Ceramic (Al2O3) 96% or 98% 
• Aluminum Nitride Ceramic ( AlN )
• Max. 137 X 190mm
• Conductor : copper
• Ceramic thickness:  0.38 | 0.50 | 0.635 | 0.76 | 1.0mm 1.5mm 2.0mm
• Copper thickness: Min.105um ( 3 oz ) , then 200um ( 0.2mm ) , 300um ( 0.3mm ) or more
• Min. Trace Space/width: 0.2 /0.2mm ( 8/8 mil )

DBC ceramic PCB application

• IGBT module
• LED modules
• Solar cell
• Electric power transmitter modules
• Sensor
• Other high temperature electronic products

Only board with Rectrangle shape can be shipped via single piece, or via panel
Soldermask is also available upon request, working temperature >500 C,
and color is semi-transparent

For same stack up, cost lower than DBC Ceramic PCB, higher than MCPCB