Thick Film Ceramic PCB

Andwin Circuits builds thick-film ceramic PCBs on Al2O3, AIN or Beryllium Oxide (BeO) substrates — conductors of silver (Ag) or gold (Au) are printed and high-temperature sintered, so resistors, capacitors and active devices can be integrated on a single ceramic board.

Thick Film Ceramic PCB Capability

Thick Film Sample c01

Finished board

Thick Film Sample c02

Finished board

Thick Film Sample c03

Finished board

Thick Film Sample c9

Finished board

Thick Film Sample c10

Finished board

Thick Film Sample 11

Finished board

Which LEDs are suitable for DTP MCPCB?

Substrate material

Aluminum oxide Ceramic (Al2O3) 96% or 98%
Aluminum Nitride Ceramic (AIN)
Beryllium Oxide (BeO)

Conductor material

Silver (Ag) or Gold (Au)

Ceramic thickness

0.25 | 0.38 | 0.50 | 0.635 | 0.76 | 1.0 | 1.5 | 2.0 mm

Conductor thickness

10 µm – 13 µm, Max. 20 µm

Min. trace space/width

0.1 / 0.1 mm ( 4 / 4 mil )

Integrated devices

Resistor, capacitor, conductor, semi-conductor and interchangable conductor on one ceramic board

Why Choose Us?

High-temperature sintering process — conductor layer is printed and sintered onto ceramic, no plating/adhesive step.

Silver / Gold conductors — Ag or Au traces give excellent conductivity and corrosion resistance.

Passive & active integration — resistors, capacitors, conductors and semiconductors can be built on one board.

Flexible resistor values — all resistors same value, or different values per resistor on the same board.

Three ceramic options — Al2O3, AIN and BeO substrates for different thermal / electrical needs.

Fine geometry — min. trace space/width 0.1 / 0.1 mm (4 / 4 mil).

Applications

High-power LED lighting fields where DTP MCPCB’s direct-bond cooling pays off .

Telecome device

Telecom equipment.

Injection System

Fuel / fluid injection control.

Anti-block Braking system

ABS electronics.

High-power LED Chip

High-power LED packages.

Wafter Street light

Street / area lighting.

Frequently Asked Questions

1. What is thick film ceramic PCB?

Thick-film ceramic PCB uses a high-temperature sintering process to form a conductor layer (silver or gold) on a ceramic substrate. Resistors, capacitors, conductors and semiconductors can be integrated on one ceramic board through printing and sintering.

2. Which ceramic substrates are supported?

The source page lists Aluminum oxide Ceramic (Al2O3) 96% or 98%, Aluminum Nitride Ceramic (AIN) and Beryllium Oxide (BeO) as the supported substrates.

3. What conductor and thickness limits apply?

Conductor is Silver (Ag) or Gold (Au); ceramic thickness from 0.25 to 2.0 mm; conductor thickness 10–13 µm, max 20 µm; min. trace space/width 0.1 / 0.1 mm (4/4 mil).

4. Where are thick film ceramic PCBs used?

Per the source page: high power electronic semi-conductor module, injection system, anti-block braking system, high-power LED chip, street light, fuel sensor resistor card, electric power transmitter modules, solar cell, sensor and telecom device.

5. How do I get a quote?

Send your PCB Gerber file and/or BOM to sales@andwinpcb.com (priority). Our team will quote as soon as possible, or you can submit the on-page form and we will contact you.