TU-872 SLK SP High Speed PCB

Cost-effective low-loss, high-thermal-reliability material — Low Dk 3.5 · Low Df 0.008 @10 GHz · Tg 200°C (DSC)

Overview

TU-872 SLK SP is ITEQ’s high-performance, low-Dk / low-Df multilayer material built on a modified epoxy FR-4 resin, reinforced with novel woven glass. It is engineered for high-speed, low-loss and high-frequency circuit boards where signal integrity matters but cost must stay controlled.

The material is lead-free (RoHS) process compatible and runs on standard FR-4 manufacturing lines — drilling, desmear, plating and lamination all follow familiar FR-4 workflows, so it drops into existing production with minimal qualification risk.

Its laminates show excellent CTE control, superior chemical and moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound — making it a dependable choice for backplanes, servers, base stations and RF builds.

Technical Data

Key Specifications — ITEQ TU-872 SLK SP Laminate

Parameter	TU-872 SLK SP
Glass Transition Temp (Tg, DMA)	220 °C
Glass Transition Temp (Tg, DSC)	200 °C
Glass Transition Temp (Tg, TMA)	190 °C
Thermal Decomposition Temp (Td, TGA)	340 °C
Time to Delamination T260	60 min
Time to Delamination T288	20 min
Time to Delamination T300	5 min
Dielectric Constant (Dk) @ 1 GHz	3.6 / 3.4
Dielectric Constant (Dk) @ 5 GHz	3.5
Dielectric Constant (Dk) @ 10 GHz	3.5
Dissipation Factor (Df) @ 1 GHz	0.006 / 0.004
Dissipation Factor (Df) @ 5 GHz	0.007
Dissipation Factor (Df) @ 10 GHz	0.008
CTE (X / Y axis)	12 – 15 ppm/°C
CTE (Z axis, 50–260 °C)	2.7 %
Volume Resistivity	> 10¹⁰ MΩ·cm
Surface Resistivity	> 10⁸ MΩ
Electric Strength	> 40 kV/mm
Dielectric Breakdown	> 50 kV
Peel Strength (1.0 oz RTF Cu)	4 – 7 lb/in
Water Absorption	0.13 %
Flammability	UL 94 V-0
Available Thickness	0.05 mm – 1.58 mm (0.002″–0.062″)
Copper Foil Cladding	1/3 – 5 oz
Prepreg Glass Styles	106, 1080, 2116

Typical values per ITEQ TU-872 SLK SP datasheet. Dk < 3.5 and Df < 0.010 are the headline design targets. Confirm exact grade, thickness & copper availability at quotation.

Why TU-872 SLK Sp High Speed PCB

Features of TU-872 SLK Sp High Speed PCB

Low, flat Dk/Df

Dk < 3.5 and Df < 0.010 with stable, flat response across frequency — predictable impedance.

Low loss @10 GHz

Df 0.008 @10 GHz — solid signal integrity for high-speed digital & RF links.

High Tg & Td

Tg 200°C (DSC) / 220°C (DMA); Td 340°C — survives lead-free reflow.

Low Z-CTE

Z-axis CTE 2.7% (50–260°C); T288 20 min — reliable plated through-holes.

FR-4 process ready

Runs on standard FR-4 lines — minimal requalification, faster ramp-up.

Anti-CAF

Allyl-network toughness boosts CAF resistance & long-term reliability.

Real TU-872 SLK SP PCB Builds

Andwin manufactures TU-872 SLK SP multilayer boards with impedance control, hybrid FR-4 stackups and tight thickness uniformity.

TU-872 SLK SP Build

High-speed multilayer board.

TU-872 SLK SP Build

Controlled-impedance stack.

Download Datasheet

Full ITEQ material properties.

Raw Material & Supplier

ITEQ (TUC)

TU-872 SLK SP is ITEQ’s low-Dk / low-Df high-thermal-reliability laminate (datasheet via tuc.com.tw). Andwin keeps TU-872 SLK SP raw laminate in safety stock — so your high-speed boards ship faster without long material lead times.

Andwin Circuits

Why Choose Us?

✓ Material in stock

TU-872 SLK SP raw laminate stocked for short lead time.

✓ Since 2003

ISO 9001 / IATF 16949 certified manufacturer.

✓ High-speed expertise

Rich experience in TU-872 SLK SP high-speed PCB manufacturing.

✓ Impedance control

Controlled-impedance stacks with TDR verification on critical nets.

✓ Hybrid stackups

TU-872 + FR-4 hybrid builds with optimized press cycles.

✓ One-by-one service

Dedicated engineering support from quote to delivery.

TU-872 SLK SP vs Other Materials

TU-872 SLK SP (ITEQ) vs MEGTRON 6 (Panasonic) vs Standard FR-4

Property	TU-872 SLK SP (ITEQ)	MEGTRON 6 (Panasonic)	Standard FR-4
Dielectric constant (Dk)	3.5 @10 GHz	3.4 @10 GHz	~4.3 – 4.5
Dissipation factor (Df)	0.008 @10 GHz	0.004 @10 GHz	~0.020
Tg (DSC)	200 °C	185 °C	~130 – 140 °C
Td (thermal decomposition)	340 °C	410 °C	~310 – 340 °C
Best use	Cost-effective high-speed digital	Ultra-low-loss 5G / servers	General digital & power
Flammability	UL 94 V-0	UL 94 V-0	UL 94 V-0
Relative cost	Mid (FR-4+ process)	Premium	Economy

Typical values per vendor datasheets. TU-872 SLK SP gives ~2.5× lower Df than FR-4 at 10 GHz and runs on standard FR-4 lines — a strong price/performance choice vs premium MEGTRON 6.

Frequently Asked Questions

1. What is TU-872 SLK SP?

TU-872 SLK SP is ITEQ’s low-Dk / low-Df, high-thermal-reliability multilayer laminate built on a modified epoxy FR-4 resin reinforced with novel woven glass. It targets high-speed, low-loss and high-frequency PCBs at a controlled cost.

2. What are the dielectric constant and loss of TU-872 SLK SP?

Dk < 3.5 (3.5 @10 GHz, 3.6/3.4 @1 GHz) and Df 0.008 @10 GHz (0.006/0.004 @1 GHz). The Dk/Df is stable and flat across frequency, which keeps impedance predictable.

3. Can TU-872 SLK SP be processed like FR-4?

Yes — it is designed for standard FR-4 manufacturing: conventional drilling, desmear, electroless/electrolytic plating and FR-4-like lamination (180–200°C press). Hybrid TU-872 + FR-4 stackups are feasible with optimized press cycles.

4. How does TU-872 SLK SP compare with FR-4 and MEGTRON 6?

Versus FR-4 it cuts Df by ~2.5× at 10 GHz with far higher Tg/Td. Versus Panasonic MEGTRON 6 it is roughly 2× higher Df but runs on standard FR-4 lines at a much lower material cost — the value choice for most high-speed digital designs.

5. What thicknesses and copper weights are available?

Laminate thickness from 0.05 mm to 1.58 mm (0.002″–0.062″), copper cladding 1/3 to 5 oz, and prepreg glass styles 106 / 1080 / 2116.

6. What is the typical lead time?

With TU-872 SLK SP raw material in safety stock at Andwin, prototype turnaround is short; exact time depends on layer count, via structure and finishing.