1. Assembly service Types:

  • SMT single or double sided

  • DIP single or double sided

  • SMT + DIP mixed technology – single or double sided

  • Press connect components

  • Conformal Coating

  • Firmware programming

  • Functional Testing

  • Assembly in plastic/metal BOX

2. Component Sourcing

  • All components sourced by Andwin

  • Customer provide part of components,other sourced by Andwin

  • Customer provide all of components

3. Lead time

  • Quick turn assembly in 24 hours

  • Regular time 2-3 days after all components arrived.

4.Package

  • Min.Package: 01005 (0.4mm*0.2mm)

  • Max.Package: No limited

  • BGA pad with 0.15mm

  • BGA pitch 0.35mm

5. Assembly Size

  • Min.Size: No limited ( Less 50X50mm need assembly fix tool )

  • Max.Size: 410mm*560mm , (600mm*1500mm for LED tube/strip )

6.Volume

  • Prototypes from 1 PCS

  • SMT 5-6 Million pad per day

  • DIP 100-150 thousand pad per days

7.SMT Parts Presentation

  • Cut Tape

  • Partial reel

  • Reel / Tube / Tray

  • Laser-cut Stainless Steel

8. Test Solutions:

  • Automated Optical Inspection (AOI)

  • In-Circuit Test

  • Reliability test

  • Hi-pot, vibration, burn in

  • Firmware programming

  • Analogue & digital functional test

  • Design For Test (DFT) Processes

  • BGA X-Ray

  • Functional Testing

  • Framescan

9.Quality Standard

  • IPC-A-610 (Class 2)

  • ISO 9001 Certified