1. Assembly service Types:

• SMT single or double sided
• DIP single or double sided
• SMT + DIP mixed technology – single or double sided
• Press connect components
• Conformal Coating
• Firmware programming
• Functional Testing
• Assembly in plastic/metal BOX

2. Component Sourcing

• All components sourced by Andwin
• Customer provide part of components,other sourced by Andwin
• Customer provide all of components

3. Lead time

• Quick turn assembly in 24 hours
• Regular time 2-3 days after all components arrived.

4.Package

• Min.Package: 01005 (0.4mm*0.2mm)
• Max.Package: No limited
• BGA pad with 0.15mm
• BGA pitch 0.35mm

5. Assembly Size

• Min.Size: No limited ( Less 50X50mm need assembly fix tool )
• Max.Size: 410mm*560mm , (600mm*1500mm for LED tube/strip )

6.Volume

• Prototypes from 1 PCS
• SMT 5-6 Million pad per day
• DIP 100-150 thousand pad per days

7.SMT Parts Presentation

• Cut Tape
• Partial reel
• Reel / Tube / Tray
• Laser-cut Stainless Steel

8. Test Solutions:

• Automated Optical Inspection (AOI)
• In-Circuit Test
• Reliability test
• Hi-pot, vibration, burn in
• Firmware programming
• Analogue & digital functional test
• Design For Test (DFT) Processes
• BGA X-Ray
• Functional Testing
• Framescan

9.Quality Standard

• IPC-A-610 (Class 2)
• ISO 9001 Certified