SH260 Polyimide PCB
Shengyi SH260, ISOLA 370HR / IS410 / IS420 in Stock | Stable for Burn-in, Down-hole & Aerospace
Overview
SH260 is rigid polyimide PCB raw material by ShengYi Technology, a high-performance polyimide laminate and prepreg for PCB raw material.
With Tg >250°C and Td 429°C, SH260 is the benchmark for sustained high-temperature PCBs — built for boards that run hot for the long haul in burn-in, down-hole and aerospace environments.
Andwin keeps Shengyi SH260 laminate in safety stock for short lead times, and provides engineering support for stack-up, impedance and DFM review.
Technical Data
Key Specifications — ShengYi SH260 Polyimide
| Parameter | ShengYi SH260 |
|---|---|
| Laminate & prepreg type | Polyimide (rigid) |
| Glass Transition Temp (Tg) | > 250 °C |
| Thermal Decomposition Temp (Td, TGA) | 429 °C |
| Typical use profile | Burn-in, down-hole, aerospace (sustained high temp) |
| Availability at Andwin | In safety stock — short lead time |
Why SH260 polyimide PCB
Features of SH260 polyimide PCB
Engineered for heavy-industry RF environments where ordinary PCBs fall short.
Tg >250°C — stays stable where standard high-Tg FR-4 fails.
Td 429°C — survives harsh thermal profiles and lead-free reflow.
Benchmark material for sustained high-temperature PCB service.
Track 3/3 mil and HDI capability for dense polyimide stacks (per page).
Controlled-impedance stacks with TDR testing on critical nets (per page).
Shengyi SH260 kept in safety stock for short lead time.
SH260 Material & Raw Material Partners
SH260 polyimide laminate from ShengYi, supplied alongside ISOLA high-Tg systems for complete high-temperature coverage.
ShengYi SH260
ShengYi Technology
ISOLA
Andwin Circuits
Why Choose Us?
✓ Long experience
Years of high-Tg & polyimide PCB manufacturing across burn-in, down-hole & aerospace.
✓ Material in stock
Shengyi SH260 and ISOLA laminates stocked for short lead time.
✓ Thermal reliability
Builds qualified to Tg >250°C and Td 429°C service profiles.
✓ Fine-line process
Track 3/3 mil and HDI capability for dense polyimide stacks.
✓ Tech support
Engineering team for stack-up, impedance & DFM review.
✓ Reasonable cost
Competitive pricing at prototype and volume scale.
SH260 vs Other High-Tg Materials
ShengYi SH260 vs ISOLA 370HR vs Standard FR-4
| Property | ShengYi SH260 | ISOLA 370HR | Standard FR-4 |
|---|---|---|---|
| Laminate type | Polyimide | High-Tg FR-4 | Standard FR-4 |
| Glass transition (Tg) | > 250 °C | 180 °C | ~130 – 140 °C * |
| Thermal decomposition (Td) | 429 °C | — | — |
| Best use | Burn-in, down-hole, aerospace (sustained high temp) | Cost-effective high-Tg digital | General digital & power |
| Halogen-free | — | Yes (per page) | Varies |
Frequently Asked Questions
1. What materials do you use for high-temperature PCBs?
We build with Shengyi SH260 polyimide (Tg >250°C, Td 429°C) and ISOLA high-Tg laminates (370HR / IS410 / IS420). SH260 leads when the board must run hot continuously; ISOLA is the cost-effective high-Tg choice.
2. What is the lead time for high-Tg PCB prototypes?
With SH260 and ISOLA laminates in safety stock, prototype turnaround is short — typically 7–12 days depending on layer count, via structure and surface finish.
3. Can you build polyimide multilayer and HDI boards?
Yes. We run high layer-count polyimide stacks and HDI (3/3 mil tracks, micro-vias) on SH260, with tight thickness control and reliable plated through-holes.
4. Can you control impedance on high-Tg materials?
Yes. We provide controlled-impedance stacks and TDR testing with ±5% tolerance on critical nets; ISOLA 370HR / IS410 are well suited to controlled-impedance digital designs.
5. What is your minimum order quantity (MOQ)?
No MOQ for prototypes — order as few as 5 pieces. Production pricing starts at 50 pieces.
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