SH260 PCB polyimide

ShengYi laminate material Tg250 C

Widely used in

  • Burn-in board

  • Down hole

  • Aircraft and Aerospace

  • Other PCB requirements to work under high temperature in long time

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What is SH260 PCB? 

SH260 is rigid polyimide PCB raw material by ShengYi Technology,
sh260 laminate TG >250 C,Thickness 0.05mm – 3.2mm.
ShengYi SH260 is High Performance, Polyimide Laminate and Prepreg PCB raw material.

  • Polyimide system

  • Ultra-high thermal performance

  • Tough resin system, Non-MDA chemistry

  • Low moisture absorption

  • Maintain mechanical strength

  • Bonding strength at high temperature

  • Halogen-free, chemistry and lead-free compatible

  • RoHS/WEEE compliant.

SH260 PCB Polymide laminate material

ShengYi SH260Datasheet    
Test ItemsTest MethodTest ConditionUnitTypical Value
TgIPC-TM-650 2.4.24TMA>250
TdIPC-TM-650 2.4.24.6TGA (5% W.L)429
T300IPC-TM-650 2.4.24.1TMAmin>60
CTE (X/Y-axis) 1)IPC-TM-650 2.4.41α1 ( 50-260 ℃ )ppm/ ℃12-15
CTE (Z-axis)IPC-TM-650 2.4.24α1 ( Before Tg )ppm/ ℃45
IPC-TM-650 2.4.2450-260 ℃%1.2
Dielectric Constant (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-4.12
Dissipation Factor (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-0.007
Volume ResistivityIPC-TM-650 2.5.17.1C-96/35/90MK-cm7.45×10 7
Surface ResistivityIPC-TM-650 2.5.17.1C-96/35/90MK4.79×10 7
Electrical Strength 1 )IPC-TM-650 2.5.6.2D-48/50+D-0.5/23kV/mm85
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-0.5/23kV>40
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-0.5/23s180
Peel Strength (1oz)IPC-TM-650 2.4.8288 ℃ /10sN/mm [lb/in]1.37 [7.83]
FlammabilityUL94C-48/23/50RatingHB
Young’s modulus 1 )IPC-TM-650 2.4.18.3200 ℃Gpa10.3
Flexural strengthIPC-TM-650 2.4.450 ℃Mpa530
200 ℃Mpa439
Water AbsorptionIPC-TM-650 2.6.2.1D-24/23%0.26

Remarks:
Specification sheet: IPC-4101/40, /41, is for your reference only.
1. All the typical value is based on the 1.6 mm specimen, but 1)specimen thickness 0.1 mm.
2. All the typical value listed above is for your reference only.

ShengYi SH260 PCB Polyimide TG>250

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  • 1.Stock raw material,short lead time.

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