PCB Prototype to production
High Quality PCB manufacturing

upto 50 Layers

High quality Complex PCB manufacturing
From PCB prototype  to volume production

8 Layers PCB
Raw material: TU-872 SLK SP

16 Layers HDI PCB
3 steps: 3+10+3 

12 Layers High speed PCB

10 Layers HDI PCB
3 steps , 3+4+3

6 Layers HDI PCB
For Blue tooth modules

4 Layers PCB
With Gold finger for connector

6 Layers HDI PCB
2+2+2 for PCB module

Custom PCB manufacturing


High quality PCB prototype, fast delivery in 12 hours!

1. High quality raw material

Andwin choose the best raw material for customer to ensure high quality PCB, KB ShengYi ITEQ ISOLA Rogers  TUE  Panasonic etc..

2. Excellent PCB equipment


Better equipments is understructure to do high quality PCB prototype production

3. DRC and DFM


DRC is the area of Electronic Design Automation that determines
Whether a particular chip layout satisfies a series of recommended parameters called Design Rules.

DRC is a very important step in Printed circuit board (PCB) manufacturing.
Any design from you are always including DRC!

4. A.O.I process

The A.O.I. checks the produced track layout for variances of

The Gerber data, and finds errors the E-Test is not capable to find.

Your multilayers Printed circuit board (PCB) are always including A.O.I.!

5. 100% TEST

Your circuit board (PCB) is checked through a so called Flying-Probe E-Test Or Fix Tooling  E-Test.

The produced PCB is checked by a netlist for short circuits and breaks.

E-Test is very important step in Printed circuit board (PCB) manufacturing.
All boards are always including E-Test!

6. Final Quality Control

Our professional team maintain constant vigilance over our processes,
we know that our products are created with the best possible processes,

And that everything we do conforms to the ISO bodies to which we subscribe.

PCB manufacturing Capability

Layers

FR-4 PCB Max. 50 L ( A )


PCB Thickness

Min. 0.35mm Max. 20mm ( A )

Copper Thickness

Out layers   ( A )   Min. 8 um    Max. 1500um
Inner layers ( B )  Min. 12.5um Max. 1200um

Drill size

Through holes  Mechanical drill  ( A ) :   Min. 0.15mm  Max.  6.5mm  Tolerance : +/-0.05mm T/D Ratio Max.12:1
Laser drill ( B ):   Min. 0.07mm  Max. 0.15mm  T/D Ratio Max. 1 : 1
Burried Via ( C ):  Mechanical drill Min. 0.15mm  Max. 0.5mm T/D Ratio Max. 1 : 1
Blind Via ( D ) :    Mechanical drill Min. 0.15mm  Max. 0.5mm  T/D Ratio Max. 1 : 1
Remark: T/D = PCB Thickness/Drill dimension

Line width

Out layer Line Width ( A ) :   Min. 0.076mm
Inner layer Line Width ( B ):   Min. 0.076mm