1. Aluminum PCB manufacturing

Thermal conductivity from 1.0 W/m.k upto 12.0W/m.k
Aluminum PCB , also,it is called Aluminium PCB,metal core PCB,mcpcb, IMS(Insulated metal substracte).

Normal aluminum PCB have 3 parts:
1.Circuit Layer (Copper Layer)
This is printed circuit copper foil layer,
From 1.0 oz up to 12 oz (35um – 420um).
Min.Trace/space 5/5mil(0.127/0.127mm)

2.Dielectric Layer(Insulated Layer)
There are very good price and delivery time if the raw material made in China and Taiwan,
we also,have many customer who choose Bergquist Thermal-Clad and Larid Tlam material,
Strict meet customer’s Requirement to manufacture the ALPCB.

3.Substrate Layer(Metal layer)
There are 4 types Aluminum, 1001, 3001, 5052, 6063.
If no requirement of this from,
we used AL1001,AL3001 for 1.0 w/m.k to 1.5 W/m.k ,
5052 for High thermal conductivity dielectronic (2.0 W/m.k to 12W/m.k)
Aluminum PCB substrate thickness: 0.4mm – 7.0mm, more thickness please inquiry.

aluminum pcb stack up
LED PCB for tube Lighting

LED PCB for tube Lighting

Aluminum pcb for LED street lighting

Aluminum pcb for LED street lighting

Bergquist MP-06503 ALPCB

Bergquist MP-06503 ALPCB

Aluminum PCB

Aluminum PCB

Aluminum PCB

Aluminum PCB

Aluminum PCB

Aluminum PCB

2. Direct thermal aluminum PCB manufacturing
Thermal conductivity upto 175.0W/m.k

Direct thermal path aluminum PCB also, have 3 parts:

1.Circuit Layer (Copper Layer 1 to 2 layers)
This is printed circuit copper foil layer,
From 1.0 oz up to 2 oz (35um – 70um).
Min.Trace/space 5/5mil(0.127/0.127mm)

2.Dielectric Layer(Insulated Layer)
FR4 or BT material, dielectric layer thickness  0.1mm to 0.2mm

3.Substrate Layer(Metal layer)
Aluminum PCB substrate thickness: 1.0mm – 2.0mm

direct thermal path aluminum pcb stack up
2 layers direct thermal path aluminum pcb stack up
direct thermal pad mpcb
direct thermal path mcpcb
direct thermal pad pcb sinkpad pcb

3. Multilayer aluminum PCB manufacturing

Multilayer aluminum PCB feature

1.Circuit Layer (Copper Layer 2 to 8 layers)
This is printed circuit copper foil layer,
From 0.5 oz up to 10 oz (17.5um – 350um).
Min.Trace/space 5/5mil(0.127/0.127mm)

2.Dielectric Layer(Insulated Layer)
FR4 or BT material, dielectric layer thickness  0.1mm to 0.2mm

3.Substrate Layer(Metal layer)
Aluminum PCB substrate thickness: 1.0mm – 9.0mm

direct thermal path aluminum pcb stack up
2layers direct thermal path aluminum pcb stack up
Get your metal core PCB quote now ! |
aluminum pcb
aluminum pcb
aluminum pcb

Aluminum Clad PCBs

Available as 1 layer Non-Plated Through Hole (single sided),
And 2+ layer Plated through Hole.
Ideal application for LED lighting, power supply solutions. Aluminium Clad Benefits Include:

  • Lower operating temperature.
  • Reduce printed circuit board size.
  • Increase power density.
  • Extend the life of dies.
  • Reduce the number of interconnects.
  • Improve product thermal and mechanical performance.
  • Combine power and control.
  • Improve product durability.
  • Enable better use of surface mount technology.
  • Expedite heat sinks and other mounting hardware.
  • Replace fragile ceramic substrates with greater mechanical durability

About Price:

Price is based on the requirement of LED PCB

1. PCB thickness: 0.6mm – 7.0mm, always thickness more ,price higher
2. Thermal conductivity: 1.0 – 12 W/m.k , thermal conductivity higher, price higher
3. Insulating layer : Min. 0.05mm  upto 0.150mm
4. Material factory: Bergquist, Laird ETC, made in US factory that is more expensive than China.

Application of  Aluminum MCPCB

Aluminum PCB application

Automotive LED lighting

Automotive LED lighting

LED stage lighting

LED street lighting

LED flash lighting

Technical options for metal core circuit boards

Andwin Metal core PCB Capability
ItemTechnical specification
StandardAdvanced
Board thicknessMaximum (mm)3.05.0
Panel sizeMaximum (mm)600×1170/
Layer countAluminum PCB1 – 8L10 L
Copper PCB1 – 8L10 L
Iron PCB1/
ceramics PCB1 – 12L/
Thermal ConductivityAluminum PCB(w/m.k)0.8 to 12
Copper PCB(w/m.k)2.0-378/
ceramics PCB(w/m.k)24
DrillingMinimum drill diameter (mm)1.00.8
2 Layer ALPCB Via0.3/
Lines/spacesMinimum0.2mm/0.2mm0.15mm/0.15mm
MaterialChao Shun(CCAF)(China)Yes/
Hua Dian(China)Yes/
Chin Shi(TaiWan)Yes/
Ventec(TaiWang)Yes/
ITEQ(Tai Wan)Yes/
ShengYi(China)Yes/
Laird(US)Yes/
Bergquist(US)Yes/
Other brand per customerYes/
Final finishingHASL Lead FreeYes/
HASLYes/
ENIGYes/
ENIPIGYes/
OSPYes/
Immersion SilverYes/
Immersion Tin/YES

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