Thermal conductivity from 1.0 W/m.k upto 12.0W/m.k

Aluminum PCB , also,it is called Aluminium PCB,metal core PCB,mcpcb, IMS(Insulated metal substracte).

Normal aluminum PCB have 3 parts:
1.Circuit Layer (Copper Layer)
This is printed circuit copper foil layer,
From 1.0 oz up to 12 oz (35um – 420um).
Min.Trace/space 5/5mil(0.127/0.127mm)

2.Dielectric Layer(Insulated Layer)
There are very good price and delivery time if the raw material made in China and Taiwan,
we also,have many customer who choose Bergquist Thermal-Clad and Larid Tlam material,
Strict meet customer’s Requirement to manufacture the ALPCB.

3.Substrate Layer(Metal layer)
There are 4 types Aluminum, 1001, 3001, 5052, 6063.
If no requirement of this from,
we used AL1001,AL3001 for 1.0 w/m.k to 1.5 W/m.k ,
5052 for High thermal conductivity dielectronic (2.0 W/m.k to 12W/m.k)
Aluminum PCB substrate thickness: 0.4mm – 7.0mm, more thickness please inquiry.

Direct thermal path aluminum PCB also, have 3 parts:

1.Circuit Layer (Copper Layer 1 to 2 layers)
This is printed circuit copper foil layer,
From 1.0 oz up to 2 oz (35um – 70um).
Min.Trace/space 5/5mil(0.127/0.127mm)

2.Dielectric Layer(Insulated Layer)
FR4 or BT material, dielectric layer thickness  0.1mm to 0.2mm

3.Substrate Layer(Metal layer)
Aluminum PCB substrate thickness: 1.0mm – 2.0mm

Multilayer aluminum PCB feature

1.Circuit Layer (Copper Layer 2 to 8 layers)
This is printed circuit copper foil layer,
From 0.5 oz up to 10 oz (17.5um – 350um).
Min.Trace/space 5/5mil(0.127/0.127mm)

2.Dielectric Layer(Insulated Layer)
FR4 or BT material, dielectric layer thickness  0.1mm to 0.2mm

3.Substrate Layer(Metal layer)
Aluminum PCB substrate thickness: 1.0mm – 9.0mm