Megtron 6 High Speed Multilayer PCB
Ultra-low loss, highly heat-resistant circuit board material — Low Dk 3.4 · Low Df 0.004 @10 GHz · Tg 185°C
Overview
MEGTRON 6 is Panasonic’s original high-speed, ultra-low-loss multilayer material and the de-facto industry standard for 5G, networking and wireless designs. It delivers excellent high-density interconnect (HDI) and thermal performance at mid-range dielectric constant.
The family — MEGTRON 6(G), 6(K) and 6(N) — is available in two reinforcement types: Low-Dk glass cloth (Laminate R-5775(N) / Prepreg R-5670(N)) and Standard E-glass cloth (Laminate R-5775 / Prepreg R-5670). The Low-Dk version is the focus here, offering the flattest Dk/Df through 10+ GHz.
Andwin manufactures Megtron 6 PCBs with raw laminate stocked from Japan, DRC (design-rule check) before production, and full HDI capability for the most demanding high-speed stacks.
Technical Data
Key Specifications — Panasonic MEGTRON 6 (R-5775(N) / R-5670(N))
| Parameter | MEGTRON 6 (R-5775(N)) |
|---|---|
| Glass Transition Temp (Tg, DSC) | 185 °C |
| Glass Transition Temp (Tg, DMA) | 210 °C |
| Thermal Decomposition Temp (Td, TGA) | 410 °C |
| Time to Delamination T288 (with Cu) | > 120 min |
| Time to Delamination T288 (without Cu) | > 120 min |
| Dielectric Constant (Dk) @ 1 GHz | 3.40 |
| Dielectric Constant (Dk) @ 10 GHz | 3.40 |
| Dielectric Constant (Dk) @ 13 GHz | 3.34 |
| Dissipation Factor (Df) @ 1 GHz | 0.002 |
| Dissipation Factor (Df) @ 10 GHz | 0.004 |
| Dissipation Factor (Df) @ 13 GHz | 0.0037 |
| CTE α1 (X / Y axis) | 14 – 16 ppm/°C |
| CTE α1 (Z axis) | 45 ppm/°C |
| CTE α2 (Z axis, >Tg) | 260 ppm/°C |
| Thermal Conductivity | 0.42 W/m·K |
| Volume Resistivity | 1 × 109 MΩ·cm |
| Surface Resistivity | 1 × 108 MΩ |
| Water Absorption | 0.14 % |
| Peel Strength (1 oz H-VLP Cu) | 0.8 kN/m |
| Flammability | UL 94 V-0 |
| Sample Thickness (core) | 0.75 mm (29.5 mil) |
Typical values per Panasonic MEGTRON 6 datasheet (R-5775(N) Low-Dk glass cloth). Confirm exact grade, thickness & copper availability at quotation.
Why Megtron 6 High Speed PCB
Features of Megtron 6 High Speed PCB
Df 0.004 @10 GHz (0.002 @1 GHz) — minimal insertion loss for high-bandwidth links.
Dk 3.4 across 1–13 GHz — predictable, stable impedance for controlled-impedance stacks.
Tg 185°C (DSC) / 210°C (DMA); Td 410°C — survives lead-free reflow & HDI.
Z-axis CTE 45 ppm/°C; T288 >120 min — reliable plated through-holes in thick stacks.
0.14% water absorption keeps electricals stable in humid environments.
Excellent high-density interconnect performance for fine-pitch, multi-layer builds.
Real Megtron 6 PCB Examples
Andwin builds Megtron 6 multilayer boards from 6 to 12+ layers with controlled impedance and tight thickness control.
6-Layer Megtron 6 PCB
Impedance controlled build.
8-Layer Megtron 6 PCB
Thickness: 2.6 mm.
12-Layer Megtron 6 PCB
Thickness: 1.8 mm.
Raw Material & Supplier
Panasonic Industry
MEGTRON 6 is Panasonic’s high-speed, low-loss multilayer material and the original PCB industry standard for 5G, networking and wireless. Andwin keeps Panasonic Megtron 6 raw laminate in safety stock — imported from Japan & USA — so your boards ship faster.
Andwin Circuits
Why Choose Us?
✓ Material in stock
Panasonic Megtron 6 raw laminate stocked for short lead time.
✓ Since 2003
ISO 9001 / IATF 16949 certified manufacturer.
✓ Megtron expertise
Rich experience in Megtron 6 high-speed PCB manufacturing.
✓ DRC before production
Design-rule check on every board before the line — no design accidents.
✓ Impedance control
Controlled-impedance stacks with TDR verification on critical nets.
✓ One-by-one service
Dedicated engineering support from quote to delivery.
Megtron 6 vs Other Materials
MEGTRON 6 (Panasonic) vs TU-872 SLK SP (ITEQ) vs Standard FR-4
| Property | MEGTRON 6 (Panasonic) | TU-872 SLK SP (ITEQ) | Standard FR-4 |
|---|---|---|---|
| Dielectric constant (Dk) | 3.4 @10 GHz | 3.5 @10 GHz | ~4.3 – 4.5 |
| Dissipation factor (Df) | 0.004 @10 GHz | 0.008 @10 GHz | ~0.020 |
| Tg (DSC) | 185 °C | 200 °C | ~130 – 140 °C |
| Td (thermal decomposition) | 410 °C | 340 °C | ~310 – 340 °C |
| Best use | Ultra-low-loss 5G / servers | Cost-effective high-speed digital | General digital & power |
| Flammability | UL 94 V-0 | UL 94 V-0 | UL 94 V-0 |
| Relative cost | Premium | Mid (FR-4+ process) | Economy |
Typical values per vendor datasheets. Megtron 6 gives ~2× lower Df than TU-872 SLK SP and ~5× lower than FR-4 at 10 GHz.
Frequently Asked Questions
1. What is Megtron 6?
MEGTRON 6 is Panasonic’s high-speed, ultra-low-loss multilayer laminate (Laminate R-5775 / Prepreg R-5670) and the original industry standard for 5G, networking and wireless applications requiring low-loss circuit materials.
2. What are the dielectric constant and loss of Megtron 6?
Low-Dk version (R-5775(N)): Dk 3.4 at 1–10 GHz (3.34 @13 GHz) and Df 0.004 @10 GHz (0.002 @1 GHz). The flat Dk/Df makes impedance predictable across frequency.
3. How does Megtron 6 compare with FR-4?
Megtron 6 has roughly half the Dk and ~5× lower Df than standard FR-4 at 10 GHz, plus far higher Tg/Td — essential for high-speed, low-loss signal integrity that FR-4 cannot deliver.
4. Can Megtron 6 be processed like FR-4?
It is a higher-grade epoxy/glass system and supports standard FR-4 processes better than PTFE materials, but still requires controlled lamination and desmear per Panasonic’s recommendations. Andwin runs it on a dedicated high-speed line.
5. What layer counts and thicknesses can Andwin build?
We have built 6-, 8- and 12-layer Megtron 6 boards (e.g. 8L @2.6 mm, 12L @1.8 mm) with impedance control, and support higher layer counts on request.
6. What is the typical lead time?
With Panasonic Megtron 6 raw material in safety stock at Andwin, prototype turnaround is short; exact time depends on layer count, via structure and finishing.
Related High-Speed & Special PCB
Ready to start your Special PCB project?
Upload your design files or contact our engineering team for a free consultation.