HDI PCB Manufacturing – High Density Interconnect PCB

Advanced 7+N+7 Capability | Laser Micro Vias 0.1mm | Up to 36 Layers | Fast Turnaround

What is HDI PCB

HDI PCB (High Density Interconnect PCB) uses advanced manufacturing technologies including laser-drilled micro vias, fine line traces, and high-density component placement to achieve superior circuit density in smaller form factors.

Our HDI PCB manufacturing capabilities include:

Stacked and staggered micro via structures
Copper-filled laser vias down to 0.1mm
Multi-layer build-up constructions (1+N+1 to 7+N+7)
Support for advanced packages (BGA, QFP, CSP)

Core Capabilities

Up to 36 Layers

Complex HDI
stackup capability

Laser Drill 0.1mm

Micro via technology

2-4 Step HDI

Any layer HDI capability

Certified Quality

Medical/Military/Aerospace

BGA 0.18mm

Fine pitch support

HDI PCB Technical Specifications & Capabilities

Andwin PCB offers comprehensive HDI PCB manufacturing capabilities with advanced micro via technology and multilayer stackup expertise.

Specification	Standard Capability	Advanced Capability
Max Layers	20 layers	36 layers
HDI Structure	1-2 step HDI (1+N+1, 2+N+2)	3-4 step HDI, Any layer HDI (ELIC)
Laser Via Size	0.15mm (6mil)	0.1mm (4mil)
Min Track/Space	4/4mil (0.1mm)	3/3mil (0.075mm)
BGA Pitch	0.4mm	0.18mm
Build-up Layers	1+N+1 to 3+N+3	Up to 7+N+7
Micro Via Type	Blind via, buried via	Stacked via, staggered via, copper filled
Board Thickness	0.4mm – 3.2mm	0.2mm – 6.0mm
Material Options	FR-4, High-Tg FR-4	ITEQ, ShengYing, Rogers, PTFE
Surface Finish	HASL, ENIG	ENIG, Immersion Silver, OSP, ENEPIG
Min. Annular Ring	3mil (0.075mm)	2mil (0.05mm)
Turnaround Time	10-15 days	5-7 days (express)

Need custom specifications? Our engineering team can handle special requirements. Contact Engineering Team

Key Features

The HDI PCB is designed with typically smaller vias and capture pads, finer lines and specs, and high connectivity of pad density.

Technical Features:

Laser-drilled blind and buried vias (0.004 diameter for micro-vias)
Fine track and gap features with laser-drilled blind vias
Smallest pad diameter for smallest footprint
1 or more “build-up” of high-density interconnection layers
Staggered or stacked micro vias on different layers
Conductors on any layer freely interconnected with copper filled stacked micro-vias
Smaller components placed closely for faster signal transmission

Performance Improvements:

Dense trace routing
Extended power stabilization
Smallest pad diameter for smallest footprint
Reduced interference effects into inductance and capacitance
Improved signaling integrity for high-speed applications
Decreased frequent relocating of components
Increased space for other components

Benefits of HDI PCB

Concentrated Transfer of Heat

The transfer of heat is reduced due to close placement of components. Thermal expansion in HDI PCB endures less stress and extends endurance.

Conductivity Management

Vias in HDI PCB can be filled with conductive or non-conductive materials. Can facilitate transmission among components and customize according to board design.

Improved Functionality

Blind vias and via-in-pad enable components to be placed closely. Increases signal strength while transmission range and delay become less.

Smaller Form Factors

Better for saving space. Number of layers can be reduced without compromising efficiency and durability as well as the design of the application device.

Non-conventional HDI Boards

HDI boards contain thinner lines, tighter spacing, and tighter annular ring using thinner specialty materials. Requires right amount of time, investment, and manufacturing process.

Enhanced Reliability

More efficient interconnections for highly complex large-pin count devices (such as CPU and GPU chips) to improve portable devices.

Stack up of HDI PCB

Stack up of 1 Step HDI PCB

1 step HDI that need one lamination process,
the most like common PCB board,
after lamination ,laser drill out layer to sub out layer.

Stack up of 2 step HDI PCB

2 step HDI , it need twice lamination process with blind buried hole,
for example,a 6 Layers HDI PCB ,
first time, laminate L2 to L4 layer board ,
then laser drill L2-L3 or/and L4-L5,
and then finish other process.

HDI PCB stack up 6 layers 2 steps

Stack up of 3 steps HDI with blind via and buried via

3 or 4 step HDI process is similarly 1 or 2 steps ,
only differenci is that need more times lamination.

Anylayer connect of HDI PCB

This type HDI PCB , need to adjust lamination stack up as normal symmetrical by our Engineer ,
but do not affect the orignal eletronical connect.
it is complex , depend on the orignal design of PCB.

Applications of HDI PCB

Medical

HDI PCBs enable compact, high-performance medical devices with reliable signal transmission. They are widely used in imaging systems, patient monitors, diagnostic equipment, implants, and portable medical electronics.

Military

Designed for demanding defense applications, HDI PCBs provide high reliability, compact layouts, and stable performance for military communication systems, radar equipment, and mission-critical electronics.

Aerospace

HDI PCBs deliver excellent durability and signal integrity in harsh environments. They are commonly used in avionics, navigation systems, satellites, and aerospace control equipment.

Automotive

HDI PCBs support advanced automotive electronics by reducing board size while improving performance. Typical applications include ADAS, infotainment systems, GPS, sensors, cameras, and electric vehicle control units.

Consumer Electronics

HDI PCBs are ideal for compact electronic devices requiring high-speed signal transmission. They are widely used in smartphones, tablets, laptops, wearable devices, cameras, and IoT products.

HDI PCB vs Standard PCB Comparison

Specification	Standard Capability	Advanced Capability
Max Layers	20 layers	36 layers
HDI Structure	1-2 step HDI (1+N+1, 2+N+2)	3-4 step HDI, Any layer HDI (ELIC)
Laser Via Size	0.15mm (6mil)	0.1mm (4mil)
Min Track/Space	4/4mil (0.1mm)	3/3mil (0.075mm)
BGA Pitch	0.4mm	0.18mm
Build-up Layers	1+N+1 to 3+N+3	Up to 7+N+7
Micro Via Type	Blind via, buried via	Stacked via, staggered via, copper filled
Board Thickness	0.4mm – 3.2mm	0.2mm – 6.0mm
Material Options	FR-4, High-Tg FR-4	ITEQ, ShengYing, Rogers, PTFE
Surface Finish	HASL, ENIG	ENIG, Immersion Silver, OSP, ENEPIG
Min. Annular Ring	3mil (0.075mm)	2mil (0.05mm)
Turnaround Time	10-15 days	5-7 days (express)

Frequently Asked Questions

What is the difference between HDI PCB and standard PCB?

HDI PCBs use laser-drilled micro vias (0.1mm) and multiple build-up layers, while standard PCBs use mechanical drilled through-holes (0.3-0.5mm). This difference allows HDI PCBs to achieve 30-50% smaller board size, higher component density, better signal integrity, and support for fine-pitch BGAs (0.18mm vs 0.4mm).

What is the minimum via size for HDI PCB?

Andwin offers laser-drilled micro vias down to 0.1mm (4mil) diameter, enabling smaller pad area, higher routing density, and more compact designs compared to traditional PCB technology.

What HDI structure do I need?

The right HDI structure depends on your application complexity. 1-Step (1+N+1) is basic HDI and cost-effective for 6-10 layers. 2-Step (2+N+2) provides high density with fine-pitch BGA support for 8-16 layers. Any-Layer (ELIC) offers maximum design flexibility for complex routing in 10-24 layers. Contact our engineering team for DFM analysis of your specific design.

How long is the turnaround time?

Standard delivery for HDI PCB is 10-15 days, with express options available in 5-7 days. Actual turnaround depends on layer count and complexity, file readiness, and current production schedule. Submit your files for an accurate quote.

What materials are available?

We support standard materials including FR-4 and High-Tg FR-4, as well as specialty materials like ITEQ, ShengYing, Rogers, and PTFE. Material selection depends on your specific application requirements including frequency, temperature range, and performance characteristics.

What file formats do you accept?

We accept all standard PCB design formats including Gerber files (.gbr, .gbl), Excellon drill files (.xln), ODB++ format, and NC drill files. Submit your files via our contact form for an instant quote and free DFM analysis.

Ready to get your HDI PCB quoted?

Our engineering team provides free DFM analysis and design support.