Metal core PCB Capability

Andwin Metal core PCB Capability
ItemTechnical specification
StandardAdvanced
Board thicknessMaximum (mm)3.05.0
Panel sizeMaximum (mm)600×1170/
Layer countAluminum PCB1 – 8L10 L
Copper PCB1 – 8L10 L
Iron PCB1/
ceramics PCB1 – 12L/
Thermal ConductivityAluminum PCB(w/m.k)0.8 to 12
Copper PCB(w/m.k)2.0-378/
ceramics PCB(w/m.k)24
DrillingMinimum drill diameter (mm)1.00.8
2 Layer ALPCB Via0.3/
Lines/spacesMinimum0.2mm/0.2mm0.15mm/0.15mm
MaterialChao Shun(CCAF)(China)Yes/
Hua Dian(China)Yes/
Chin Shi(TaiWan)Yes/
Ventec(TaiWang)Yes/
ITEQ(Tai Wan)Yes/
ShengYi(China)Yes/
Laird(US)Yes/
Bergquist(US)Yes/
Other brand per customerYes/
Final finishingHASL Lead FreeYes/
HASLYes/
ENIGYes/
ENIPIGYes/
OSPYes/
Immersion SilverYes/
Immersion TinYES/