Rogers RO4003C PCB

Rogers RO4003C raw material in stock · Fast 7–10 day delivery

What is Rogers RO4003C high frequency PCB?

Rogers RO4003C belongs to the Rogers RO4000 series — a woven-glass reinforced hydrocarbon ceramic laminate engineered to deliver superior high-frequency performance at a competitive fabrication cost. It offers near-PTFE electrical behavior while running on standard epoxy/glass (FR-4) lines.

With a lower dielectric constant of 3.38, RO4003C is the cost-sensitive sibling of RO4350B — ideal for antennas, LNAs, filters and couplers where stable impedance and low loss matter but budget is tight. Andwin keeps genuine RO4003C laminate in stock for fast turnaround.

Technical Data

Key Specifications

Typical values of RO4003C laminate. Final stack-up parameters are confirmed at quotation based on your Gerber / stack-up drawing.

Parameter	Rogers RO4003C
Dielectric Constant (εr, z-axis, 10 GHz)	3.38 ± 0.05
Dissipation Factor (10 GHz)	0.0027
Thermal Conductivity	0.71 W/m·K
Moisture Absorption	0.06%
Coefficient of Thermal Expansion (z, 50–150°C)	46 ppm/°C
Glass Transition Temp (Tg)	> 280 °C
Decomposition Temp (Td)	425 °C
Copper Foil Options	0.5 / 1.0 / 2.0 oz (17–70 µm), ED & RT
Standard Core Thickness	8, 12, 16, 20, 32, 60 mil (0.2–1.5 mm)
Flammability	UL 94 V-0

Dk / Tg / Td / thickness / copper from live page; Df / thermal conductivity / moisture / UL per Rogers CORP datasheet. Confirm exact grade at quotation.

Why RO4003C

Features of Rogers RO4003C PCB

The cost-effective member of the RO4000 family — low loss and stable Dk without the PTFE price tag.

Ultra-low loss

Df 0.0027 at 10 GHz keeps signal integrity high across microwave bands.

Thermal management

Tg > 280 °C and Td 425 °C handle RF power stages reliably.

Low moisture absorption

0.06% uptake keeps Dk stable from lab to harsh field environments.

Stable dielectric constant

3.38 ± 0.05 enables predictable, repeatable impedance control.

FR-4 process compatible

Fabricated on standard epoxy/glass lines — no PTFE tooling required.

Aerospace ready

Near-PTFE performance at FR-4-class cost for budget-sensitive designs.

Raw Material & Trusted Supplier

We build RO4003C boards on genuine Rogers Corporation laminates — woven-glass reinforced hydrocarbon ceramic supplied directly from stock, so your order ships without material lead-time risk.

Available material family includes RO3003, RO3006, RO3035, RO3203, RO4000, RO4003, RO4350B, RO4360G2, RO4450B and RO4500, plus Taconic & Arlon RF grades on request.

Andwin Circuits

Why Choose Us?

✓ Rogers RO4003C material kept in stock — faster delivery than made-to-order houses.

✓ PCB manufacturer since 2003 with IATF 16949 / ISO 9001 / UL certified lines.

✓ Controlled-impedance expertise for RF & microwave stack-ups.

✓ Hybrid RO4003C + FR-4 builds to balance cost and performance.

✓ Free samples available for design evaluation.

✓ Resistant to a wide range of chemicals for rugged deployments.

RO4003C vs FR-4

How It Compares to Ordinary PCB

Rogers 4003C is purpose-built for high frequency; standard FR-4 is not.

Property	Rogers RO4003C	Standard FR-4
Best use	Cost-effective high-frequency RF	Low-loss general digital & power
Dielectric constant	3.38 ± 0.05 (stable)	~4.2–4.5 (varies)
Dissipation factor	0.0027 @10 GHz	~0.02 (higher loss)
Moisture absorption	0.06% (lowest)	Higher
Cost position	Mid — cheaper than RO4350B	Economy
Harsh environment	Aerospace / defense ready	Standard switching boards

Frequently Asked Questions

1.What is Rogers RO4003C used for?

It is used for high-frequency RF and microwave circuits where cost matters — antennas, LNAs, filters, couplers, automotive radar and base-station front-ends that need low loss and stable impedance.

2. How is RO4003C different from standard FR-4?

RO4003C has a stable dielectric constant (3.38 ± 0.05) and far lower loss (Df 0.0027). FR-4 varies in Dk and loses signal integrity at microwave frequencies, making it unsuitable for precision RF.

3. What is the typical lead time?

Because we keep Rogers RO4003C laminate in stock, typical delivery is 7–10 days for standard builds. Hybrid or high-layer-count jobs are quoted case by case.