Turnkey PCB assembly service

100% Quality Guarantee or Money back

Automatic Optic Inspection / X-Ray / Functional Test

Ask a quote now

PCB Assembly products

direct thermal path mcpcb

6 Layers HDI PCB
PCB Size 6X12mm
BGA 0.18mm 3/3 mil Trace
Application: Medical

direct thermal path mcpcb

6 Layers PCB
Heavy Copper 6 OZ
Application: Industry control device

direct thermal path mcpcb

PCB: 2 Layers 2 OZ
Holes copper : 25um
Application: Oil Probing Equipment

direct thermal path mcpcb

8 Layers PCB Via in pad
BGA 0.3mm 0201
Application: Analytical instrument for large equipment

direct thermal path mcpcb

8 Layers High speed PCB
BGA 0.25mm
Application: Industry main Board

Excellent equipment

Better equipments is understructure to do high quality production

Capability package 01005 – 0201 – 0402 – BGA 0.18mm

Automatic solder paste printer

3D SPI (Solder Paste Inspection online)



8 Temperature zone reflow oven


Get professional one stop PCB solution from us!

Get in touch!

How to ensure quality in turnkey PCB Assembly Service?

5 steps to ensure your product 100% are working 

1 First Article Inspection (FAI)

FAI can be understood as the first piece quality inspection before the start of mass pcb assembly.

Is to avoid the large quantities defective that because of the process,operation or other reasons.

Each resistor,capacitance and inductance will be inspected by LCR meter.
The chips verified by QC with BOM and Assembly drawing.

2 Automatic Optic Inspection 

AOI device is for inspection the compoents placement and solder joint quality after SMT(Surface Mounted Technology).

To achieve better quality control,find and remove the errors early in the assembly process.

It is avoid the defective product to assembly,will avoid scrapping the repairable circuit board.

3 X-Ray inspection

X-ray is a very short wavelength of electromagnetic waves, the wavelength range of 0.0006 a 80nm,
with a strong penetration,X-ray could penetrate a variety of different density of the material.

When the design have BGA or QFN,for checking the solder quality that could not be visible by eyes.

We will use X-ray machine to inspect the BGA or QFN package in finished PCB assembly.

4 Final Quality Assuerance (FQA)