Rigid flex PCB Capability
| Andwin Circuits Rigid-Flex Capablity | ||
| Item | Description | Capability |
| Rigid Flex Layer | General | 1-16 |
| Flex Layer | General | 1-6 |
| Hole to Rigid Flex Edge | >0.5mm | |
| Material | FR-4,High Tg | YES |
| DuPont | YES | |
| Arlon | YES | |
| Lines/spaces | Minimum | 3/3m mil (0.075/0.075mm) |
| Drilling | Drill Min. | 0.2mm(8 mil) |
| CNC Machine Drill Max. | 6.35mm(250 mil) | |
| Board thickness | 1-2 Layers Maximum | 3.0mm(118mil) |
| Multilayer Maximum | 8.0mm(315mil) | |
| Aspect Ration | 10:1 | |
| Panel size | 1-2 Layers Maximum | 220 X 600mm |
| Multilayer Maximum | 210x600mm | |
| Copper thickness | External Flex Cu Thickness | 1/4 OZ – 1 OZ ( 8.75um – 35um) |
| External Rigid Cu Thickness | 1 OZ – 5.5OZ(35un – 193um) | |
| Internal Flex Cu Thickness | 1/4 OZ – 1 OZ ( 8.75um – 35um) | |
| Internal Rigid Cu Thickness | 0.5OZ – 1.5OZ ( 17um – 53um) | |
| Solder mask | Color | Green, Blue, White, Black, Red, etc. |
| Min Solder mask Bridge | 2mil(0.050mm) | |
| Plugged Hole Diameter | 8mil-20mil ( 0.20mm-0.50mm) | |
| Final finishing | HASL Lead Free | Yes |
| ENIG | Yes,(Gold 1 U” – 10 U”) | |
| OSP | Yes | |
| Immersion Silver | Yes | |
| Immersion Tin | YES | |
| Plat hard Gold Finger | YES,10 U” – 30 U” | |
| Profile | CNC Routing Tolerance General | +/-0.13MM(5mil) |
| CNC Routing Tolerance Min. | +/-0.1mm(4mil) | |
| V-scoring | +/-0.1mm, 15 30 45 60 Deg. | |
| Beveling | 30 45 Deg. | |
| Sink Hole | YES | |
| Impedance Controlled | Tolerance | Min.+/-5%, General+/-10% |
| Impedance Tested | Yes,100% | |
| Certification | UL RoHS ISO9001 SGS | YES |
| Inspect Standard | IPC 6012B Class 2 | YES |
| IPC 6012B Class 3 | YES | |
| File | Gerber Protel DXP | Avalible |
| Auto CAD PADS OrCAD Express PCB etc | Avalible | |