Why choose us?
Free DRC – Design Rule Check
Our engineer 100% DRC your Gerber file before manufacturing.
100% E-Test – All PCB are tested,this process could ensure all PCB are
work well.
Visual – FQC FQA
Our engineer 100% visual your final PCB.
Aluminum oxide ( Al2O3 ) Ceramic PCB
Aluminum oxide Ceramic PCB substrate (Al2O3) is white color
Thermal conductivity Min. 24 W/m.k up to 30W/m.k
Aluminum Nitride (AIN / ALN) Ceramic PCB
Aluminum Nitride Ceramic PCB substrate ( AlN ) is brown
Thermal conductivity Min.275 W/m.k up to 320 W/m.k
Which industral we serviced?
High Power LED lighting
Laser machine Application:
Medical Equipment :
Aeronautics and space :
Solar energy :
Ceramic PCB widely be use in many industries,
Please contact us by e-mail : sales@andwinpcb.com for you ceramic PCB
Ceramic PCB manufacturing Capability
Layers
Max. 12 L ( A )
PCB Thickness
Min. 0.15mm Max. 9.0mm ( A )
Copper Thickness
Out layers ( A ) Min. 10 um Max. 1200um
Inner layers ( B ) Min. 10 um Max. 300um
Drill size
Laser drill : Min. 0.10mm Max. No limimited
Line width
Out layer Line Width ( A ) : Min. 60um
Inner layer Line Width ( B ): Min. 60um
More knowleage about ceramic PCB
What is ceramic PCB?
Ceramic PCB (Printed Circuit Board) is a type of circuit board made of ceramic materials
such as alumina,aluminum nitride, Silicon nitride (SI3N4),Beryllium Oxide,Boron Nitride,
Silicon Carbide and Zirconia etc.
These materials have high thermal conductivity and excellent electrical insulation properties,
Making them suitable for high-power and high-frequency applications.
Ceramic PCBs are commonly used in electronic devices such as laser device, power modules,
LED lighting, and microwave devices.
They are also known for their durability, reliability, and resistance to thermal and mechanical stress.
Due to ceramic PCBs have high thermal conductivity and low expansion coefficient (CTE),
Ceramic circuit boards are more versatile, less complex and offer superior performance
Compared to regular PCBs.
Many users of printed circuit boards find ceramic PCBs have an advantage over traditional boards made of other materials.
How many types ceramic PCBs?
DPC ceramic PCB / DBC ceramic PCB / Thick film ceramic circuit board / AMB ceramic circuit board
1. DPC ceramic PCB
DPC is direct plate copper technical.
DPC ceramic PCB stands for Direct Plated Copper ceramic Printed Circuit Board.
It is a type of printed circuit board that uses a ceramic substrate instead of a traditional
fiberglass substrate (FR4).
The ceramic material offers better thermal conductivity and electrical insulation properties,
making it ideal for high-power and high-frequency applications.
The DPC technology involves directly plating copper onto the ceramic substrate,
eliminating the need for a separate copper layer,
which reduces the board’s thickness and improves its thermal performance.
DPC ceramic PCBs are commonly used in power electronics, LED lighting, and aerospace
applications.
DPC ceramic PCB advantage:
1. Min. conductor thickness: 10um (0.4mil )
The mean, You could design line width and space with very small
Min. Line width/Space :10um/10 um ( 0.4 / 0.4 mil )
2. More ceramic PCB substrate options
Alumina ( AL2O3 96% 99.6% )
Aluminum nitride (AIN ALN )
Silicon nitride ( SI3N4 )
Beryllium Oxide ( BeO )
Boron Nitride ( BN )
Silicon Carbide (SiC)
Zirconia ( ZrO2 )
Andwin could meet all of your DPC ceramic PCB substrate requirement,
You could choose suitable Ceramic PCB substrate for your electronic products.
DPC ceramic PCB Shortcoming:
Also,DPC ceramic PCB could meet your heavy copper upto 300um,
But the cost is very high.
Andwin provide you a economical suggestion – DBC ceramic PCB.
2. DBC ceramic PCB
DBC is direct bond copper technique.
Copper foil bonded directly to alumina (AL2O3) or aluminum nitride (AIN,ALN) substrates one
sided or double side at high temperatures.
Copper thickness: Min. 70um ( 2 OZ ) upto 300um
Ceramic material: alumina (AL2O3) or Aluminum nitride(AIN,ALN)
DBC Ceramic PCB advantage:
Meet thick copper requirement with comfortable cost,
Widely use IGBT and solar energy
DBC ceramic PCB Shortcoming:
Could not do plate through holes ( PTH )
3. Thick film ceramic PCB
Thick film ceramic printed circuit board is a type of ceramic PCB
That uses a thick film deposition process to create conductive traces and other circuit elements
on the ceramic substrate.
The thick film deposition process involves printing a paste of conductive materials,
such as silver, gold, or platinum, onto the surface of the ceramic PCB substrate,
And then firing it at high temperatures to create a permanent bond between the conductive
material and the ceramic substrate.
This process is repeated to create multiple layers of conductive traces and insulating layers,
resulting in a multi-layered ceramic PCB.
Thick film ceramic PCBs are commonly used in high-temperature and high-power applications,
Such as power electronics, automotive electronics, and aerospace industries,
Due to their excellent thermal conductivity and high mechanical strength.
Thick film ceramic PCB advantage:
1.It is lower cost ceramic PCB if use silver conductor
2.Via holes avaible for double sided ceramic circuit board.
Thick film ceramic PCB shortcoming:
Min.conductor width/Space : 0.15mm/0.15mm
During the thick film ceramic circuit board use silk printed technique,
Could not do very thin trace.
4. AMB ceramic circuit board
AMB is active metal brazing technology.
The AMB ceramic PCB is a type of printed circuit board that uses a ceramic PCB substrate instead of the traditional fiberglass or epoxy substrate.
AMB technology is a further development of DBC technology.
It is a method of combining ceramics and metals by using active metal elements (such as Ti/Ag/Zr/Cu) in solder.
Ceramics form a reactive layer that can be wetted by liquid solder.
The bonding in the AMB ceramic substrate is achieved by the chemical reaction of the ceramic
And the active metal solder at temperature,
And the Si3N4 ceramic used in the AMB has a higher thermal conductivity (>90W/mK)
Compared to the traditional Al2O3 ceramic substrate 25°C),
Which is closer to the thermal expansion coefficient of silicon (2.6×10 -6 /K).
Therefore, the AMB substrate has high adhesive strength and reliability.
Combined with silver sintering process and high-power silicon carbide chip,
AMB copper layer with active metal coating can realize high power,
Better heat dissipation and high reliability packaging module (can withstand 3000 thermal shocks),
Which has been widely used in Electric vehicles,electric motives and high-speed trains.
How to choose your ceramic pcb substrate material?
alumina,aluminum nitride, Silicon nitride (SI3N4),Beryllium Oxide,Boron Nitride,
Silicon Carbide and Zirconia
There are 2 types ceramic pcb substrate material are widely be used,
Aluminum oxide Ceramic (Al2O3) and Aluminum Nitride Ceramic ( AlN )
Also, there are called as aluminum oxide Ceramic pcb or Aluminum Nitride Ceramic pcb.
Aluminum oxide Ceramic PCB substrate (Al2O3) is white color
Thermal conductivity Min. 24 W/m.k up to 30W/m.k
Aluminum Nitride Ceramic PCB substrate ( AlN ) is brown
Thermal conductivity Min.275 W/m.k up to 320 W/m.k
Silicon nitride
Thermal conductivity Min.20 w/m.k upto 80 w/m.k
Beryllium Oxide ( BeO )
Thermal conductivity Min.200 w/m.k upto 250 w/m.k
Boron Nitride ( BN )
Thermal conductivity Min.80 w/m.k upto 600 w/m.k
Silicon Carbide (SiC)
Thermal conductivity Min.80 w/m.k upto 180 w/m.k
Zirconia ( ZrO2 )
Thermal conductivity 5 – 20 W/m.k
At room temperature (25°C), the thermal conductivity of zirconia is about 5-8 W/(m·K).
When the temperature increases, the thermal conductivity of zirconia will gradually increase,
And it can reach about 20 W/(m K) at high temperatures (about 1000 °C).
Insulation and conductivity
Zirconia ceramics do not conduct heat, do not conduct electricity at room temperature, and conduct electricity at around 1500°C
Zirconia ceramics have a negative temperature coefficient of resistance and are good electrical insulators at room temperature with a high resistivity.
But as the temperature rises, its resistivity drops sharply, and it has become a very good conductor at 1500 °C.
Zirconia ceramic PCB could use for special device such as laser device and space etc.
Aluminum Nitride ceramic PCB substrate have better thermal conductivity,
Also,higher cost, choose a suitable material according your products.
It is important to choose the highly appropriate substrates for your electronic circuits.
There are different kinds of boards available,
but ceramic pcb get more fame among circuit board users because of its versatility.
If you want to get the best kinds of boards, you can contact us.
We offer the most reliable solutions based on the printed circuit boards requirements of
our customers.
The main reason to use these solutions is that they are ideal for all kinds of electronic
circuits which have minimal expansion coefficient and increased thermal conductivity.
With better versatility,
It appears as a perfect alternative to existing printed circuit board boasting of increased
performance and minimal complex design.
It ensures that ceramic pcb work effectively on chip-on-board modules, high-power circuits,
and proximity sensors.
Types of ceramic pcb conductor wire
Copper / Silver/ Gold / Platinum / Titanium and other
1. Copper conductor:
There are 3 types Copper conductor ceramic PCB
1. DPC – Direct plate copper
-Min. Copper thickness 10um
–2 Layers with plated via holes is available.
-work temperature up to 350 degrees Celsius
-( in inert gases up to 850 )
2. DBC – Direct bonded copper
-Min. Copper thickness 100um Max. 800um
-2 Layers with plated via holes is not available.
-work temperatureup to 350 degrees Celsius
-( in inert gases up to 850 )
3. AMB – active metal brazing
-Min. Copper thickness 100um Max. 800um
-2 Layers with plated via holes is not available.
-work temperatureup to 350 degrees Celsius
-( in inert gases up to 850 )
DBC ( Direct Bonding Copper ) Ceramic + copper foil circuits board
DBC heat-sinking substrate for solar battery is fabricated
by using bonding technology under high temperature.
The conjunction between copper foils and ceramic is molecular
bond and any adhesion agent is not being used.
Due to the fine adhesion between copper foils and ceramic plate.
it can suffer from strict thermal cycling test.
under the normal temperature environment,the islation performance and material
strength can hold several hundred thousand hours stability.
Other materials can not compare to this on.
Because the ceramic material has fine thermal conductive preperty
the compound material has low resistance.
In the succeeding processes,
By the photoresist and chemical etching methods and fine laster cutting process.
DBC heat-sinking substrate for solar battery possesses various accurate
and complex patterns and outlines.
2. Silver conductor:
Thick film technology
Silver conductor thickness is 10um – 20um
2 layers with via is available
Work temperature up to 350 degrees Celsius
3. Gold conductor:
There are 2 types technics to achived the pure gold conductor
1. Thick film technology
Used the silk print gold to ceramic PCB substrate
The gold conductor thickness is 10um – 20um
2. Vacuum sputtering technology
Gold thickness around 3-5um,
General use for precise components with very small size.
Work temperature up to 850 degrees Celsius
4. Platinum conductor:
Work temperature up to 850 degrees Celsius
Stackup of ceramic pcb
The application of ceramic PCB
Advantage of ceramic PCB
1. High thermal conductivity property and low thermal resistance,
Could increase the efficiency and operation lifetime of semi- conductor chips.
2. Excellent thermal cycling performance and fine mechanic strength.
3. High isolating strength
4. The thermal expansion coefficient is close to that of the silicon chip.
5. Strong current conductive ability
6. Fine environment compatiblity,no environment contaminative elements,
Such as PB,Hg and Cr,etc. be able to pass strict environment protection credentials.
Ceramic PCB Knowledge
The famous brand ceramic PCB customers
Western Digital Honeywell
Andwin Circuits Co.,Limited
Please send email: sales@andwinpcb.com ( priority ) with your PCB file ( Gerber or DXF PDF etc ) to us,
Our teams will quote for you as soon as possible.
Or submit follow form our team will contact you soon.