With the development of electronic communication technology, wireless radio frequency circuit technology is used more and more widely. The functional objectives of the radio frequency circuit directly affect the quality of the entire product. The anti-interference design of the radio frequency PCB circuit board is of great significance in reducing the electromagnetic information radiation of the system….
Printed circuit boards (PCBs) are convenient thin sheets used to house interconnected electrical components in a simple, convenient and economical manner. They are used as physical supports for mounting and connecting different electrical components. PCB is made of fiberglass, composite epoxy or any other composite material with a metal coated surface. They feature etchings made using…
The production process of PCB (Printed Circuit Board) can be roughly divided into the following steps: Open material. First, cut the copper-clad laminate (a fiberglass or epoxy material covered with a copper film on both sides) to the desired size. Copper clad laminate is the basic material of PCB and is used to fix electronic…
Mixed-signal PCB design requires a basic understanding of analog and digital circuits to minimize, if not prevent, signal interference. Modern systems are made up of components that operate in both the digital and analog domains and must be carefully designed to ensure signal integrity throughout the system. As an important part of the mixed-signal development…
PCB is also known as printed circuit board. Whether in college or in society, many friends have been exposed to PCB. In order to enhance everyone’s understanding of PCB, this article will introduce the differences and connections between PCB and PCBA, as well as PCB proofing. If you are interested in PCB, you may wish to…
Nowadays, as the trend increases, most of the automotive, consumer and industrial applications usually contain one or more microcontrollers. Usually several electronic modules build an application system, although several applications and/or systems may run nearby. As the number of electronic applications increases, their density in any given environment increases. Therefore, the ambient electromagnetic noise observed…
As bandwidth continues to increase, deregulation and competition in wired and wireless infrastructure telecommunications systems drive the need for low-cost equipment solutions. The ever-increasing challenges of power management requirements for telecommunications equipment increasingly require designers to be able to power a wide range of digital signal processors (DSPs), field programmable gate arrays (FPGAs), application specific…
MAGTREX™ 555 laminate is an industry first low loss laminate with controlledpermeability and permittivity. MAGTREX 555 materials are constructed froma proprietary, low loss, high resistivity ceramic filler and a high temperaturethermoplastic matrix. This yields a system which is conformable, PCBprocessable, and mechanically and electrically stable. MAGTREX 555 materials offer a miniaturization factor comparable to amaterial…
Specifically formulated to have FR-4 matched dielectric constant (Dk),design transition to Kappa 438 laminates will be effortless. Theselaminates also exhibit low loss, tight Dk and thickness tolerancesneeded to meet the growing performance needs of the wirelessmarket traditionally served by higher end FR-4 materials. Demand forwireless data is growing exponentially, driving a need for substantiallyhigher levels…
IsoClad laminates are nonwoven fiberglass/PTFEcomposites for use as printed circuit boardsubstrates. The nonwoven reinforcement allowsthese laminates to be used more easily inapplications where the final circuit will be bent toshape. Conformal or “wrap-around” antennas area good example. IsoClad products use longer random fibers and aproprietary process to provide greater dimensionalstability and better dielectric constant uniformitythan competitive…
DiClad® laminates are woven fiberglass/PTFE composite materials for use as printedcircuit board substrates. Precise control of the fiberglass/PTFE ratio, DiClad laminatesoffer a range of choices from the lowest dielectric constant and dissipation factor to amore highly reinforced laminate with better dimensional stability. The woven fiberglass reinforcement in DiClad products provides greater dimensionalstability than nonwoven fiberglass…
The AD Series™ antenna materials from Rogers Corporation are highperformance, specialty materials that are specifically engineered andmanufactured to meet the demands of today’s wireless antenna markets.Rogers has the materials needed to meet these design needs both todayand into the future. The AD Series antenna products are glass-reinforced, PTFE based materialsthat provide controlled dielectric constant, low…
XtremeSpeed™ RO1200™ extremely low loss digital circuit materials are ceramic-filledlaminates reinforced with woven fiberglass. These materials are engineered to offerexceptional electrical performance and mechanical stability for the most demanding highspeed applications. XtremeSpeed RO1200 series laminates combine the surface smoothness of a non-wovenPTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFElaminate….
TMM® thermoset microwave materials are ceramic, hydrocarbon, thermosetpolymer composites designed for high plated-thru-hole reliability striplineand microstrip applications. TMM laminates are available in a wide range ofdielectric constants and claddings.The electrical and mechanical properties of TMM laminates combine many ofthe benefits of both ceramic and traditional PTFE microwave circuit laminates,without requiring the specialized production techniques common…
TC600™ woven fiberglass reinforced, ceramic filled, PTFE-based compositefor use as a printed circuit board substrate is designed to provide enhancedheat-transfer through “Best-In-Class” thermal conductivity, while reducingdielectric loss and insertion loss. Lower losses result in higher Amplifier andAntenna Gains/Efficiencies. Mechanical robustness is also greatly improvedfor the 6.15 dielectric constant market. The increased thermal conductivity of TC600…