PCB Solder Joint Failure Mechanisms: An In-Depth Analysis of Poor Solder Wetting Phenomena
Abstract This paper examines the underlying failure mechanisms behind poor solder wetting phenomena in printed circuit board (PCB) assembly processes. With the continuous miniaturization of electronic components and increasing complexity of PCB designs, solder joint reliability has become critical for product quality. The article systematically analyzes various factors contributing to solder wetting failures, including metallurgical…















