“Discover advanced techniques integrating PCB design and fabrication processes to optimize production efficiency. Learn how to minimize errors, reduce costs, and accelerate timelines through intelligent material selection and DFM guidelines.”
In the field of electronic products, PCB (Printed Circuit Board) is an extremely critical component. Whether it is a high-speed circuit, a high-frequency circuit or a millimeter-wave related product, it is indispensable. The processing of PCB boards is a complex system engineering, covering multiple aspects such as PCB materials, potions, processing technology and line geometry…
This article delves into effective strategies for optimizing PCB design and fabrication processes, highlighting techniques that enhance performance, reduce costs, and improve reliability in electronic applications.
1.[Delamination] Delamination is a long-standing problem of PCB, and ranks first among common problems. The reasons for its occurrence may be as follows: (1) Improper packaging or storage, dampness; (2) Storage time is too long, exceeding the shelf life, PCB board dampness; (3) Supplier material or process problems; (4) Poor design material selection and copper…
Explore cutting-edge techniques in PCB design and fabrication to enhance efficiency and quality. This article provides essential insights for achieving successful electronic projects, optimizing processes, and embracing innovation in the industry.