flex pcb design guidelines

FPC, or flexible printed circuit board, is an electronic component with high flexibility and bendability.

With the continuous development of science and technology, FPC is increasingly used in various fields and has become an indispensable part of the modern electronic manufacturing industry.

FPC factory is the core enterprise for the production of FPC, responsible for closely combining multiple links such as circuit design, material selection, and production process to produce high-quality FPC products.

During the production process, the FPC factory needs to strictly abide by the relevant production standards and quality control requirements to ensure that the performance and quality of the product meet customer requirements.

Circuit boards are an important application area of ​​FPC. In modern electronic products, circuit boards carry the connection and communication tasks of various electronic components and are the basis for realizing the functions of electronic products.

As an important type of circuit board, FPC has higher flexibility and bendability, and can adapt to various complex product shapes and design requirements, so it has been widely used in electronic products.

In addition to circuit boards, FPC is also widely used in the field of circuit boards. Circuit boards are an important part of electronic equipment, responsible for connecting electronic components to achieve current transmission and control.

As a highly flexible circuit board, FPC can maintain stable performance in various complex environments. Therefore, it has been widely used in aerospace, medical equipment, automotive electronics and other fields.

GET PCB MANUFACTURING AND ASSEMBLY QUOTE NOW!

GET PCB AND ASSEMBLY SERVICE QUOTE NOW!

FPC soft board thermal design guide

1. Temperature-sensitive components (electrolytic capacitors, etc.) should be kept as far away from heat sources as possible.

·For heat sources with a temperature higher than 30oC, the general requirements are:

·Under air cooling conditions, the distance between sensitive components and heat sources is not less than 2.5mm;

·Under natural cooling conditions, the distance from the heat source is not less than 4mm.

2. The different sizes of the fan inlet and outlet will cause a great change in air flow resistance (the larger the fan inlet, the better).

3. For components and integrated circuit chips that may have heat dissipation problems, flexible circuit board manufacturers should try to reserve enough space for placement improvement solutions, in order to place metal heat sinks and fans.

4. For components and integrated circuit chips that can generate high heat, they should be placed at the outlet or in a position that is conducive to convection.

5. For large openings in heat dissipation and ventilation design, large long holes can generally be used instead of small round holes or grids to reduce ventilation resistance and noise.

6. During the layout of the printed circuit board, space should be reserved as much as possible between each component, between integrated circuit chips, or between components and chips, in order to facilitate ventilation and heat dissipation.

7. For integrated circuit chips with high heat generation, they are generally placed on the motherboard as much as possible to avoid overheating of the bottom shell. If they are placed under the motherboard, a certain amount of space needs to be reserved between the chip and the bottom shell, so that the space for gas flow heat dissipation or placement of improvement solutions can be fully utilized.

8. For higher components in the printed circuit board, designers should consider placing them at the vents, but be careful not to block the wind path.

9. In order to ensure good tin penetration in the printed circuit board, for the component pads on the large area of ​​copper foil, it is required to use insulation tape to connect to the pads; and for the pads that need to pass a large current of more than 5A, insulation pads cannot be used.

10. In order to avoid the phenomenon of deviation or tombstone after the reflow soldering of components, the pads at both ends of the components of 0805 or below 0805 should ensure the symmetry of heat dissipation, and the width of the connection part between the pad and the printed conductor should generally not exceed 0.3mm.

11. For components or integrated circuit chips and heat dissipation components with high heat in the printed circuit board, the editor recommends that they should be placed as close to the edge of the printed circuit board as possible to reduce thermal resistance.

12. Under the rule, the contact pressure between the heat dissipation components such as fans and the components that need to be dissipated should be as large as possible, and at the same time, confirm that the two contact surfaces are in full contact.

13. The shape and size of the fan inlet, as well as the design of the tongue and involute must be carefully considered. In addition, there should be no obstruction between 3 and 5 mm outside the fan inlet.

14. For heat dissipation solutions using heat pipes, the corresponding area in contact with the heat pipe should be increased as much as possible to facilitate heat conduction of heat-generating components and integrated circuit chips.

15. Turbulence in space generally produces high-frequency noise that has an important impact on circuit performance, and its generation should be avoided.

The above is the thermal design principle of flexible circuit boards compiled by the FPC factory. I hope everyone will gain something!

Similar Posts