Skip to content
Andwin Circuits
  • Home
  • ProductsExpand
    • HDI multilayer PCB
    • Rigid Flex PCB
    • Flex pcb
    • Special PCBExpand
      • High Frequency PCBExpand
        • Rogers RO4350B PCB
        • Rogers RO4003 pcb
        • Rogers RO3003 PCB
        • Rogers 5880 PCB
        • DICLAD 527 PCB
        • Taconic TLX series
        • Taconic TLX-8 RF PCB
        • Taconic TLX-9 RF PCB
      • High speed pcbExpand
        • Megtron 6 High Speed PCB
        • TU-872 SLK Sp High Speed
      • High TG PCBExpand
        • SHENGYI SH260 PCB
        • ISOLA 370HR PCB
        • ISOLA IS410 PCB
        • ISOLA IS420 PCB
      • Heavy copper PCB
      • Copper coin pcb
      • Copper inlay PCB
    • Metal Core PCBExpand
      • Copper core pcb
      • Aluminum PCB
      • 2 Layers Aluminum PCB
      • Direct thermal MCPCB
      • 2 Layers Direct Thermal
    • Ceramic PCBExpand
      • DPC ceramic PCB
      • DBC ceramic PCB
      • Thick film Ceramic PCB
      • Al2O3 Alumina PCB
      • AIN ALN ceramic PCB
      • IGBT Ceramic PCB
  • ServiceExpand
    • PCB Assembly
    • Quick turn PCB assembly
    • PCBA conformal coating
  • IndustryExpand
    • Telecommunication
    • IoT and Wireless
    • Industrial Control
    • Thermal management
    • Power and Energy
    • IC test board
    • Automative
    • Medical
  • CapabilityExpand
    • Rigid PCB
    • Rigid flex PCB
    • Metal core PCB
    • PCB Assembly
  • TechnologyExpand
    • Blogs
    • Via in pad
    • PCB E-test
    • PCB stack up
    • MCPCB panelization
    • Controlled impedance PCB
  • AboutExpand
    • About us
    • Certification
    • Factory Tour
  • Contact
Andwin Circuits
Home / How to design RF and digital-analog circuits on the same PCB?

How to design RF and digital-analog circuits on the same PCB?

ByGrace January 9, 2025March 31, 2026

The popularity of handheld wireless communication devices and remote control devices is driving a significant increase in the demand for mixed analog, digital and RF designs. Handheld devices, base stations, remote controls, Bluetooth devices, computer wireless communications, many consumer electronics, and military/aerospace systems now require RF technology.

For many years, RF design has required professional designers using specialized design and analysis tools.

Typically, the RF portion of a PCB is designed by RF professionals in a separate environment and then merged with the rest of the mixed-technology PCB. This process is inefficient and often requires iterative design and the use of multiple, unrelated databases in order to integrate with hybrid technologies.


In the past, design functions were performed and duplicated in two design environments, connected by a non-intelligent ASCII interface (Figure 1(a)). The PCB system design and RF dedicated design systems in both environments have their own libraries, RF design databases and design archives. This requires that design data (schematic and layout) and libraries in both environments be managed and synchronized through a cumbersome ASCII interface.

Contact us for PCB quote now |


Under this old approach, RF designers developed RF circuits in isolation from the rest of the PCB system design.

The RF circuit is then translated into the overall PCB design using an ASCII file, creating both the schematic and the physical implementation on the main PCB. If there is a problem with the RF circuit, the design must be corrected in the separate RF solution and then re-translated into the main PCB.


RF simulators only simulate ideal RF circuits.

In actual hybrid system implementations, there are many fragmented ground planes, ground planes, and adjacent RF circuits, which makes analysis very difficult, and everyone knows that these additional shapes will have a long-term impact on the operation of the RF circuits.
This old approach has been used successfully for mixed-signal board design for many years, but as the RF content of products has increased, the problems caused by two independent design systems have begun to affect designers’ productivity, time to market and product quality. quality.

To address these issues, Mentor Graphics has developed a dynamic link technology that integrates PCB schematic and layout tools with RF design and simulation tools, resulting in a new solution that overcomes traditional The shortcomings of RF design.

Contact us for PCB quote now |


RF aware PCB design


To maintain design intent between PCB and RF designs, RF design tools must understand the layer-oriented structure in PCB layout, and PCB systems must understand the parameterized planar microwave components used in the RF design environment.


Another key issue is that the PCB system layouts the RF circuits into short circuits, which prevents proper design rule checking (DRC) of the design. For today’s complex RF system designs, functional RF-aware DRC is a must for design methodology to ensure correct design.
All of this helps maintain design intent. Preserving design intent is critical as it is the basis for enabling multiple round trips of design data between toolsets without loss of information.


RF design is an iterative process that requires many steps to adjust and optimize the design. In the past, RF design was very difficult in the context of real PCB design. When an optimized RF module is implemented on a PCB, there is still no guarantee that it will still work optimally. As a verification, an electromagnetic field analysis (EM) of the PCB implementation is required.

Contact us for PCB quote now |
Post Tags: #aluminum clad pcb#aluminum core pcb#aluminum pcb#assemble pcb

Post navigation

Previous Previous
PCB board design based on Protel
NextContinue
How to make your PCB design better

Search

Search

Products

  • HDI Multilayer PCB
  • Rigid Flex PCB
  • Flex pcb
  • High Frequency PCB
  • High speed pcb
  • Heavy copper PCB
  • Metal Core PCB
  • Ceramic PCB

Address

Andwin Circuits Co.,Limited
Email: sales@andwinpcb.com
Tel: +86 755 2832 9394
Fax:+86 755 2992  6717
ADD:1-2F-1217,HouDeQun Industrial park,
NanTing RD NO.56,ShaJing,BaoAn,Shenzhen 518104,GuangDong,China

Products

  • HDI Multilayer PCB
  • Rigid Flex PCB
  • Flex pcb
  • High Frequency PCB
  • High speed pcb
  • Heavy copper PCB
  • Metal Core PCB
  • Ceramic PCB

Technology

  • Blogs
  • Via in pad
  • PCB E-test
  • PCB stack up
  • Metal core PCB panelization
  • Controlled impedance PCB

CERTIFICATION

Certification >>

 

Copyright© 2003 - 2026 Andwin | All Rights Reserved | Powered by Andwin

Scroll to top
  • Home
  • Products
    • HDI multilayer PCB
    • Rigid Flex PCB
    • Flex pcb
    • Special PCB
      • High Frequency PCB
        • Rogers RO4350B PCB
        • Rogers RO4003 pcb
        • Rogers RO3003 PCB
        • Rogers 5880 PCB
        • DICLAD 527 PCB
        • Taconic TLX series
        • Taconic TLX-8 RF PCB
        • Taconic TLX-9 RF PCB
      • High speed pcb
        • Megtron 6 High Speed PCB
        • TU-872 SLK Sp High Speed
      • High TG PCB
        • SHENGYI SH260 PCB
        • ISOLA 370HR PCB
        • ISOLA IS410 PCB
        • ISOLA IS420 PCB
      • Heavy copper PCB
      • Copper coin pcb
      • Copper inlay PCB
    • Metal Core PCB
      • Copper core pcb
      • Aluminum PCB
      • 2 Layers Aluminum PCB
      • Direct thermal MCPCB
      • 2 Layers Direct Thermal
    • Ceramic PCB
      • DPC ceramic PCB
      • DBC ceramic PCB
      • Thick film Ceramic PCB
      • Al2O3 Alumina PCB
      • AIN ALN ceramic PCB
      • IGBT Ceramic PCB
  • Service
    • PCB Assembly
    • Quick turn PCB assembly
    • PCBA conformal coating
  • Industry
    • Telecommunication
    • IoT and Wireless
    • Industrial Control
    • Thermal management
    • Power and Energy
    • IC test board
    • Automative
    • Medical
  • Capability
    • Rigid PCB
    • Rigid flex PCB
    • Metal core PCB
    • PCB Assembly
  • Technology
    • Blogs
    • Via in pad
    • PCB E-test
    • PCB stack up
    • MCPCB panelization
    • Controlled impedance PCB
  • About
    • About us
    • Certification
    • Factory Tour
  • Contact
Search