SH260 polyimide PCB

ShengYi laminate material Tg250 C

Widely used in

Burn-in board
Down hole
Aircraft and Aerospace
Other PCB requirements to work under high temperature in long time

What is SH260 polymide PCB?

SH260 is rigid polyimide PCB raw material by ShengYi Technology,
sh260 laminate TG >250 C,Thickness 0.05mm – 3.2mm.
ShengYi SH260 is High Performance, Polyimide Laminate and Prepreg PCB raw material.

Polyimide system
Ultra-high thermal performance
Tough resin system, Non-MDA chemistry
Low moisture absorption
Maintain mechanical strength
Bonding strength at high temperature
Halogen-free, chemistry and lead-free compatible
RoHS/WEEE compliant.

ShengYi SH260	Datasheet
Test Items	Test Method	Test Condition	Unit	Typical Value
Tg	IPC-TM-650 2.4.24	TMA	℃	>250
Td	IPC-TM-650 2.4.24.6	TGA (5% W.L)	℃	429
T300	IPC-TM-650 2.4.24.1	TMA	min	>60
CTE (X/Y-axis) 1)	IPC-TM-650 2.4.41	α1 （ 50-260 ℃ ）	ppm/ ℃	12-15
CTE (Z-axis)	IPC-TM-650 2.4.24	α1 （ Before Tg ）	ppm/ ℃	45
	IPC-TM-650 2.4.24	50-260 ℃	%	1.2
Dielectric Constant (1GHz)	IPC-TM-650 2.5.5.9	C-24/23/50	–	4.12
Dissipation Factor (1GHz)	IPC-TM-650 2.5.5.9	C-24/23/50	–	0.007
Volume Resistivity	IPC-TM-650 2.5.17.1	C-96/35/90	MK-cm	7.45×10 7
Surface Resistivity	IPC-TM-650 2.5.17.1	C-96/35/90	MK	4.79×10 7
Electrical Strength 1 ）	IPC-TM-650 2.5.6.2	D-48/50+D-0.5/23	kV/mm	85
Dielectric Breakdown	IPC-TM-650 2.5.6	D-48/50+D-0.5/23	kV	>40
Arc Resistance	IPC-TM-650 2.5.1	D-48/50+D-0.5/23	s	180
Peel Strength (1oz)	IPC-TM-650 2.4.8	288 ℃ /10s	N/mm [lb/in]	1.37 [7.83]
Flammability	UL94	C-48/23/50	Rating	HB
Young’s modulus 1 ）	IPC-TM-650 2.4.18.3	200 ℃	Gpa	10.3
Flexural strength	IPC-TM-650 2.4.4	50 ℃	Mpa	530
		200 ℃	Mpa	439
Water Absorption	IPC-TM-650 2.6.2.1	D-24/23	%	0.26

Remarks:
Specification sheet: IPC-4101/40, /41, is for your reference only.
1. All the typical value is based on the 1.6 mm specimen, but 1)specimen thickness 0.1 mm.
2. All the typical value listed above is for your reference only.

High TG PCB