aluminum pcb

Current density of wiring : Most electronic circuits are now made of copper-bonded insulating boards. The copper thickness of commonly used circuit boards is 35μm. The current density value of the wiring can be taken according to the empirical value of 1A/mm. The specific calculation can be referred to the textbook. In order to ensure…

With the improvement of power semiconductor device performance and the innovation of switching conversion technology, power electronics technology has been widely used in various power supply equipment. At present, switching power supply products are becoming more and more small, high-speed and high-density. This trend has led to increasingly serious electromagnetic compatibility issues. The high-frequency switching…

Today, PCB design considers more and more complex factors, such as clock, crosstalk, impedance, detection, manufacturing process, etc., which often requires designers to repeat a lot of layout, routing, verification and maintenance work. The parameter constraint editor can compile these parameters into formulas to help designers better handle these sometimes even conflicting parameters during the…

1.Q: We have introduced the problem of pure resistance. There must be some resistors whose performance is exactly what we expected. What about the resistance of a wire? A: It is different. You probably mean a wire or a conductive strip in a printed circuit board that acts as a wire. Since room temperature superconductors…

In high-speed design, the characteristic impedance problem of controlled impedance boards and lines troubles many Chinese engineers. This article introduces the basic properties, calculation and measurement methods of characteristic impedance in a simple and intuitive way. In high-speed design, the characteristic impedance of controlled impedance boards and lines is one of the most important and…

To repair a relatively unfamiliar circuit board without any schematic diagram, the so-called “experience” in the past will be difficult to achieve. Although people with a solid hardware foundation are confident in repair, if the method is not appropriate, the work will still be ineffective. So, how can we improve the efficiency of repair? According…

High speed and high density have gradually become one of the significant development trends of many modern electronic products, and high speed and high density pcb design technology has become an important research filed. Compared with traditional PCB design, high-speed and high-density PCB design has several key technical issues, which requires the development of new…

1 Introduction Human society has entered a highly developed information society, and the development of the information society is inseparable from the progress of electronic products. While the performance of modern electronic products has improved and the complexity has increased, the price has been on a downward trend, and the pace of product replacement has…

High speed and high density have gradually become one of the significant development trends of many modern electronic products, and high speed and high density PCB design technology has become an important research field. Compared with traditional PCB design, high-speed and high-density PCB design has several key technical issues, which requires the development of new…

Protel99 has two types of electrical layers. Open a PCB design document and press the shortcut key L to display the layer setting window. The one on the left (SIGNAL LAYER) is the positive layer, including TOP LAYER, BOTTOM LAYER and MIDLAYER, and the one in the middle (INTERNAL PLANES) is the negative layer, namely…

PCB manufacturing technology includes computer-aided manufacturing processing technology, that is, CAD/CAM, and photolithography technology. The general process of photolithography is: check the file – determine the process parameters – convert CAD file to Gerber file – CAM processing and output. 1.Computer-aided manufacturing processing technology Computer-aided manufacturing (CAM) is to carry out various process processing according…