as it must withstand various mechanical stresses during its operational life. The lamination process also involves the application of a solder mask

Introduction Solder mask over vias (commonly referred to as “via tenting” or “via capping”) is a crucial PCB manufacturing consideration that affects both the aesthetics and functionality of printed circuit boards. This process involves covering vias with solder mask to protect them from environmental factors, prevent solder wicking during assembly, and improve surface planarity for…