Enig process pcb manufacturing

he Electroless Nickel Immersion Gold (ENIG) process is a critical aspect of printed circuit board (PCB) manufacturing, offering a reliable and efficient method for creating high-quality, durable PCBs. This process involves the application of a thin layer of nickel followed by a layer of gold onto the copper pads of a PCB. The ENIG process is highly valued in the electronics industry due to its ability to provide excellent surface planarity, corrosion resistance, and solderability, which are essential for the performance and longevity of electronic devices.