Abstract Organic Solderability Preservative (OSP) is a widely used surface finish for printed circuit boards (PCBs) due to its cost-effectiveness, flat surface, and environmental friendliness. However, OSP-coated PCBs are prone to soldering defects such as poor wetting, non-wetting, and weak intermetallic compound (IMC) formation. This paper analyzes the root causes of OSP-related soldering defects and…
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