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PCB Etching Inspection Based on Spectral Confocal Technology
Abstract Printed Circuit Board (PCB) manufacturing requires high precision in etching processes to ensure proper conductivity and signal integrity. Traditional inspection methods, such as optical microscopy and profilometry, face limitations in resolution, speed, and depth measurement accuracy. This paper proposes a novel approach using spectral confocal technology for PCB etching inspection. By leveraging the high-resolution,…

