The role of flex pcb reflow

Reflow refers to the process of heating and cooling the PCB to melt and then solidify the solder paste that is used to attach electronic components to the board.

During the reflow process, the flex PCB is placed in a reflow oven, which heats the board to a specific temperature.

The solder paste on the board then melts and flows, creating a strong bond between the components and the PCB.

Once the solder has solidified, the board is cooled and can be inspected and tested.

GET IN TOUCH!

The role of flex PCB reflow is to ensure that the electronic components are securely attached to the flexible PCB.

This process is critical for the reliability and performance of the final product. It also helps to reduce the risk of defects and failures during the product’s lifespan.

Overall, flex PCB reflow is an essential step in the manufacturing process of flexible PCBs.

It helps to ensure that the electronic components are securely attached to the board, providing reliable and high-performance products.

GET IN TOUCH!

Similar Posts