TU-872 SLK Sp High Speed PCB

About TU-872 SLK Sp

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin.
This material is reinforced with novel woven glass,
And designed with extra low dielectric constant and,
low dissipation factor for high speed low loss and high frequency circuit board application.

TU-872 SLK Sp material is suitable for environmental protection lead free process
Also, compatible with FR-4 processes.
TU-872 SLK Sp laminates also exhibit excellent CTE,
Superior chemical resistance, moisture resistance,
Thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

Tg (DMA)   220°C
Tg (DSC)    200°C
Tg (TMA)   190°C
Td (TGA)    340°C
CTE z-axis (50 to 260 °C)       2.7%
T-260/ T288        60 min/ 20 min
Permittivity (RC 50%)   @10GHz            3.5
Loss Tangent (RC 50%)   @10GHz         0.008

high speed pcb

Application TU-872 SLK Sp High Speed PCB

  • Radio Frequency
  • Backpanel
  • High performance computing
  • Line cards,Storage
  • Servers,Telecom
  • Base station
  • Office Routers
high speed pcb

Key feature of TU-872 SLK Sp High Speed PCB

  • Dielectric constant less than 3.5
  • Dissipation factor less than 0.010
  • Excellent, stable and flat Dk/Df performance
  • Compatible with most FR-4 processes
high speed pcb

Standard Parameter 

  • Thickness: 0.002” [0.05mm] to 0.062” [1.58mm]
  • Copper Foil Cladding: 1/3 to 5 oz
  • Prepregs Glass Styles: 106, 1080 and 2116

Dowload Datasheet 

DOWN LOAD HERE!

Why Choose Andwin?

  • Rich experience in High speed PCB
  • TU-872 SLK Sp raw material in stock, PCB delivery faster
  • One by one service

High Speed PCB

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