PCB failure analysis
As the carrier of various components and the hub for circuit signal transmission, PCB has become the most important and critical part of electronic information products.
Its quality and reliability determine the quality and reliability of the entire equipment. However, due to cost and technical reasons, PCBs have experienced a large number of failure problems during production and application.
For this kind of failure problem, we need to use some common failure analysis technologies to ensure the quality and reliability level of PCB during manufacturing. For this reason, as a senior company in the PCB proofing industry, Shenzhen Jieduobang Technology When Wang Gong of the Co., Ltd. talked about failure analysis technology, he focused on summarizing nine technologies for PCB failure analysis, including: appearance inspection, X-ray perspective inspection, metallographic section analysis, thermal analysis, photoelectron spectroscopy analysis, display Micro-infrared analysis, scanning electron microscopy analysis and X-ray energy spectroscopy analysis, etc.
Then some common failure analysis techniques must be used. Between the structural characteristics of PCB and the main mode of failure, metallographic section analysis is a destructive analysis technology.
Once these two technologies are used, the sample will be destroyed and cannot be recovered; in addition, due to the requirements for sample preparation, it may Scanning electron microscopy analysis and X-ray energy spectroscopy analysis sometimes require partial destruction of the sample.
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