1. Aluminum PCB manufacturing
Thermal conductivity from 1.0 W/m.k upto 12.0W/m.k
Aluminum PCB , also,it is called Aluminium PCB,metal core PCB,mcpcb, IMS(Insulated metal substracte).
Normal aluminum PCB have 3 parts:
1.Circuit Layer (Copper Layer)
This is printed circuit copper foil layer,
From 1.0 oz up to 12 oz (35um – 420um).
Min.Trace/space 5/5mil(0.127/0.127mm)
2.Dielectric Layer(Insulated Layer)
There are very good price and delivery time if the raw material made in China and Taiwan,
we also,have many customer who choose Bergquist Thermal-Clad and Larid Tlam material,
Strict meet customer’s Requirement to manufacture the ALPCB.
3.Substrate Layer(Metal layer)
There are 4 types Aluminum, 1001, 3001, 5052, 6063.
If no requirement of this from,
we used AL1001,AL3001 for 1.0 w/m.k to 1.5 W/m.k ,
5052 for High thermal conductivity dielectronic (2.0 W/m.k to 12W/m.k)
Aluminum PCB substrate thickness: 0.4mm – 7.0mm, more thickness please inquiry.
2. Direct thermal aluminum PCB manufacturing
Thermal conductivity upto 175.0W/m.k
Direct thermal path aluminum PCB also, have 3 parts:
1.Circuit Layer (Copper Layer 1 to 2 layers)
This is printed circuit copper foil layer,
From 1.0 oz up to 2 oz (35um – 70um).
Min.Trace/space 5/5mil(0.127/0.127mm)
2.Dielectric Layer(Insulated Layer)
FR4 or BT material, dielectric layer thickness 0.1mm to 0.2mm
3.Substrate Layer(Metal layer)
Aluminum PCB substrate thickness: 1.0mm – 2.0mm
3. Multilayer aluminum PCB manufacturing
Multilayer aluminum PCB feature
1.Circuit Layer (Copper Layer 2 to 8 layers)
This is printed circuit copper foil layer,
From 0.5 oz up to 10 oz (17.5um – 350um).
Min.Trace/space 5/5mil(0.127/0.127mm)
2.Dielectric Layer(Insulated Layer)
FR4 or BT material, dielectric layer thickness 0.1mm to 0.2mm
3.Substrate Layer(Metal layer)
Aluminum PCB substrate thickness: 1.0mm – 9.0mm
Aluminum Clad PCBs
Available as 1 layer Non-Plated Through Hole (single sided)，
And 2+ layer Plated through Hole.
Ideal application for LED lighting, power supply solutions. Aluminium Clad Benefits Include:
- Lower operating temperature.
- Reduce printed circuit board size.
- Increase power density.
- Extend the life of dies.
- Reduce the number of interconnects.
- Improve product thermal and mechanical performance.
- Combine power and control.
- Improve product durability.
- Enable better use of surface mount technology.
- Expedite heat sinks and other mounting hardware.
- Replace fragile ceramic substrates with greater mechanical durability
About Price:
Price is based on the requirement of LED PCB
1. PCB thickness: 0.6mm – 7.0mm, always thickness more ,price higher
2. Thermal conductivity: 1.0 – 12 W/m.k , thermal conductivity higher, price higher
3. Insulating layer : Min. 0.05mm upto 0.150mm
4. Material factory: Bergquist, Laird ETC, made in US factory that is more expensive than China.
Application of Aluminum MCPCB
Technical options for metal core circuit boards
| Andwin Metal core PCB Capability | |||
| Item | Technical specification | ||
| Standard | Advanced | ||
| Board thickness | Maximum (mm) | 3.0 | 5.0 |
| Panel size | Maximum (mm) | 600×1170 | / |
| Layer count | Aluminum PCB | 1 – 8L | 10 L |
| Copper PCB | 1 – 8L | 10 L | |
| Iron PCB | 1 | / | |
| ceramics PCB | 1 – 12L | / | |
| Thermal Conductivity | Aluminum PCB(w/m.k) | 0.8 to 12 | |
| Copper PCB(w/m.k) | 2.0-378 | / | |
| ceramics PCB(w/m.k) | 24 | ||
| Drilling | Minimum drill diameter (mm) | 1.0 | 0.8 |
| 2 Layer ALPCB Via | 0.3 | / | |
| Lines/spaces | Minimum | 0.2mm/0.2mm | 0.15mm/0.15mm |
| Material | Chao Shun(CCAF)(China) | Yes | / |
| Hua Dian(China) | Yes | / | |
| Chin Shi(TaiWan) | Yes | / | |
| Ventec(TaiWang) | Yes | / | |
| ITEQ(Tai Wan) | Yes | / | |
| ShengYi(China) | Yes | / | |
| Laird(US) | Yes | / | |
| Bergquist(US) | Yes | / | |
| Other brand per customer | Yes | / | |
| Final finishing | HASL Lead Free | Yes | / |
| HASL | Yes | / | |
| ENIG | Yes | / | |
| ENIPIG | Yes | / | |
| OSP | Yes | / | |
| Immersion Silver | Yes | / | |
| Immersion Tin | / | YES | |
Metal core PCB
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