The two most critical processes that help successfully rework SMT are also the two most easily overlooked issues: Appropriate preheating of the PCB before reflow; 1.Quick cooling of the solder joints after reflow. Since these two fundamental processes are often overlooked by rework technicians, in fact, sometimes the condition after rework is worse than before…
Fill means drawing a solid copper sheet, connecting all the connections and vias in the area together, regardless of whether they belong to the same network. If there are two networks, VCC and GND, in the drawn area, the Fill command will connect the elements of these two networks together, which may cause a short…
IC packages rely on PCBs to dissipate heat. Generally speaking, PCBs are the primary cooling method for high-power semiconductor devices. A good PCB thermal design can have a huge impact on the system’s good operation or the potential for thermal accidents. Careful handling of PCB layout, board structure, and device mounting can help improve the…
PCB copy board refers to the service of redrawing PCB data based on existing products (finished products\circuit boards) for re-production when there is a lack of PCB data and the circuit board cannot be produced. Generally speaking, PCB copy board is faster and has better quality than re-developing products, because a PCB design to mass…
The interconnection of the circuit board system includes three types of interconnection: chip to circuit board, interconnection within the PCB board, and between the PCB and external devices. In RF design, the electromagnetic characteristics at the interconnection point are one of the main problems faced by engineering design. This article introduces various techniques for the…
Although the current EDA tools are very powerful, as the PCB size requirements are getting smaller and smaller and the device density is getting higher and higher, the difficulty of PCB design is not small. How to achieve a high PCB routing rate and shorten the design time? This article introduces the design skills and…
Cleaning technology of circuit boards in PCB copy boards At present, there are four main new generation cleaning technologies for circuit boards: 1.Semi-aqueous cleaning technology Semi-aqueous cleaning mainly uses organic solvents and deionized water, plus a certain amount of surfactants and additives to form a cleaning agent. This type of cleaning is between solvent cleaning…
PCB copper-clad laminate is the substrate material for making printed circuit boards. In addition to supporting various components, it can also achieve electrical connection or electrical insulation between them.The manufacturing process of PCB copper-clad laminate is to impregnate glass fiber cloth, glass fiber felt, paper and other reinforcing materials with adhesives such as epoxy resin…
Discover how full turnkey PCB assembly services streamline your production process, reduce costs, and enhance product quality. Experience the convenience and efficiency of a comprehensive solution for all your PCB manufacturing needs.
This article explores efficient gerber fabrication techniques to streamline PCB production, discussing strategies for optimizing file outputs, reducing unnecessary data, and improving overall workflow in the circuit board design process.
In recent years, with the rapid development of new processes and new devices, high-speed devices have become more and more popular, and high-speed circuit design has become a commonly needed technology. TI’s DSPs chip TMS320C62xx, C64xx, and C67xx series devices are one of the rapidly developing high-speed devices. The internal structure of C6000 is fixed-point,…
With the rapid development of the modern electronic industry, digital and high-frequency circuits are developing in the direction of high speed, low consumption, small size and high anti-interference, which puts higher requirements on PCB (printed circuit board, printed circuit board) design. The Protel 99SE design system fully utilizes the advantages of Windows XP and Windows…
With the development of the electronics industry, the integration of electronic components is getting higher and higher, while the size is getting smaller and smaller, and BGA type packaging is widely used. Therefore, the lines of PCBs will become smaller and smaller, and the number of layers will increase. Reducing the line width and line…
With the development of communication technology, handheld wireless RF circuit technology is increasingly used, such as wireless pagers, mobile phones, wireless PDAs, etc. The performance indicators of the RF circuits directly affect the quality of the entire product. One of the biggest features of these handheld products is miniaturization, and miniaturization means that the density…
Grounding is undoubtedly one of the most difficult issues in system design. Although it is relatively simple in concept, it is complex to implement. Unfortunately, there is no concise, step-by-step method to ensure good results, but if some details are not handled correctly, they can cause headaches. “ground” is the reference point for signals. For…
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