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Reasons for instability of PCB electroless nickel plating solution
ByGrace November 27, 2024November 28, 2024
First, the reason for the instability of electroless nickel plating solution 1. When the gas slowly releases the plating solution from the inside of the plating solution and starts to decompose by itself, the gas is not only released on the surface of the plating member, but also slowly and uniformly discharged in the entire…
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How to produce FPC double-sided anti-oxidation board
ByGrace November 27, 2024November 25, 2024
1. Select materials This is one of the main factors affecting the production of FPC flexible boards, so the materials selected will affect the entire circuit board production process. 2. Cutting and drilling This is a step that every FPC board must go through. In addition to the manual cutting and drilling, many factories use…
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Flex pcb capabilities
ByGrace November 27, 2024November 25, 2024
Design Innovations Enabled by Flex PCB Technology Flex PCB technology has revolutionized the landscape of electronic design, offering a myriad of innovative possibilities that were previously unattainable with traditional rigid circuit boards. This advancement in technology has not only expanded the horizons of design but also enhanced the functionality and reliability of electronic devices across…
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PCB drilling: the main reasons and preventive measures for breaking the drill nozzle
ByGrace November 27, 2024November 25, 2024
1. Drilling parameters: The setting of drilling parameters is very important. The drilling speed is too fast. It is broken when the drilling nozzle is too strong. The drilling speed is too slow, which will reduce the production efficiency. Because the board thickness, copper thickness, and sheet structure of the PCB boards produced by each…
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Discussion on Electromagnetic Compatibility Design of SCM System from PCB Design to Software Processing
ByGrace November 27, 2024November 23, 2024
PCB design to software processing to introduce the handling of electromagnetic compatibility. First, the factors that affect EMC 1, the voltage: the higher the power supply voltage, means that the greater the voltage amplitude, the more emission, and low power supply voltage sensitivity. 2, frequency: high-frequency produce more emissions, periodic signals produce more emissions. In…
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Fr4 multilayer pcb
ByGrace November 27, 2024November 25, 2024
Advantages Of Using FR4 Material In Multilayer PCBs FR4 material has become a cornerstone in the design and manufacturing of multilayer printed circuit boards (PCBs), offering a range of advantages that make it a preferred choice for engineers and manufacturers alike. At the heart of its popularity is its excellent balance of performance, cost-effectiveness, and…
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Engineers commonly used interface
ByGrace November 27, 2024November 23, 2024
The complete definition of the interface is that the entity provides an abstraction provided to the outside world to separate external communication methods by internal operations so that they can be modified internally without affecting the way other entities in the world interact with them, Multiple abstractions provided by design. Complex feeling, in fact, the…
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PCB through hole introduction
ByGrace November 26, 2024November 22, 2024
Via is one of the important components of a multi-layer PCB. The cost of drilling is usually 30% to 40% of the cost of PCB board. Simply put, every hole in the PCB can be called a via. From the perspective of function, the vias can be divided into two categories: One is used as…
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PCB circuit board layer full resolution
ByGrace November 26, 2024November 23, 2024
Process characteristics of selective welding The process characteristics of selective soldering can be understood by comparison with wave soldering. The most obvious difference between the two is that the lower portion of the PCB in the wave soldering is completely immersed in the liquid solder, while in selective soldering, only certain areas are in contact…
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PCB circuit board layer full resolution
ByGrace November 26, 2024November 22, 2024
A. The bottom pad layer of the top layer of the PCB circuit board: Toppaste and Bottompaste are the bottom pad layer of the top layer. It refers to the exposed copper we can see. (For example, we drew a wire in the top wiring layer. This wire we see on the PCB is just…
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Introduction of Standards Used in Printed Circuit Boards
ByGrace November 26, 2024November 22, 2024
1) IPC-ESD-2020: Joint standard for the development of electrostatic discharge control procedures. Includes the design, setup, implementation, and maintenance of the ESD control program. According to the historical experience of certain military organizations and business organizations, it provides guidance for the handling and protection of ESD sensitive periods. 2) IPC-SA-61 A: Semi-aqueous cleaning manual after…
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FPC opening – double sided FPC manufacturing process
ByGrace November 26, 2024November 22, 2024
PCB board composition The current circuit board consists mainly of the following: 1. Line and Pattern: The line is used as the conduction between the originals. In the design, a large copper surface is additionally designed as the grounding and power layer. Lines and drawings are made at the same time. 2. Dielectric: used to…
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FPC opening – double sided FPC manufacturing process
ByGrace November 26, 2024November 22, 2024
Except for some materials, the materials used in flexible printed boards are basically roll-shaped. Since not all processes must be processed by the tape process, some processes must be cut into sheets for processing. For example, drilling holes in metalized holes of double-sided flexible printed boards can only be drilled in sheet form. Holes, so…
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PCB circuit board heat treatment points
ByGrace November 26, 2024November 25, 2024
There are many PCB surface treatment processes, common are hot air leveling, organic solderability protection agent (OSP), full-plate nickel-plated gold, heavy gold, heavy tin, heavy silver, chemical nickel-palladium gold, and hard gold plating. A variety of processes. 1, hot air leveling (spraying) The general process of the hot air leveling process is: micro-etching → pre-heating…
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PCB circuit board heat treatment points
ByGrace November 26, 2024November 25, 2024
The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will continue to heat up and the device will fail due to overheating, and the reliability of the electronic device will decrease. Therefore, it is…
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advanced circuits 4pcb

Reasons for instability of PCB electroless nickel plating solution

How to produce FPC double-sided anti-oxidation board

Flex pcb capabilities

PCB drilling: the main reasons and preventive measures for breaking the drill nozzle

Discussion on Electromagnetic Compatibility Design of SCM System from PCB Design to Software Processing

Fr4 multilayer pcb

Engineers commonly used interface

PCB through hole introduction

PCB circuit board layer full resolution

PCB circuit board layer full resolution

Introduction of Standards Used in Printed Circuit Boards

FPC opening – double sided FPC manufacturing process

FPC opening – double sided FPC manufacturing process

PCB circuit board heat treatment points

PCB circuit board heat treatment points

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