“Discover key techniques to combat tombstoning in PCB assembly. Learn how pad design optimization, thermal management, and solder paste control prevent component lifting, ensuring reliable surface-mount connections and reduced manufacturing defects.”
This article explores tombstoning in PCB assembly, a common defect where components stand upright on the board. It delves into causes, prevention methods, and techniques to ensure reliable electronic connections for enhanced performance.
This article explores tombstoning in PCB assembly, a common defect where components stand upright during soldering. Learn about its causes, effects on performance, and effective strategies for prevention to ensure reliable electronic designs.