Rogers 5880 datasheet

– Dielectric constant (Dk): 2.20 +/- 0.02
– Dissipation factor (Df): 0.0009 @ 10 GHz
– Thickness: 0.020″ (0.508 mm)
– Copper foil thickness: 1 oz/ft2 (0.035 mm)
– Operating temperature range: -55°C to +125°C
– RoHS compliant

For more detailed information, you can refer to the Rogers 5880 datasheet available on the Rogers Corporation website or contact a Rogers representative for assistance.

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What the Rogers 5880 Data Sheet Says

The Rogers 5880 datasheet provides technical information about the material properties of the Rogers 5880 laminate. Here are some key points from the datasheet:

– The Rogers 5880 laminate is a high-frequency material designed for use in microwave applications.
– The dielectric constant (Dk) of the material is 2.20 +/- 0.02, which is relatively low compared to other materials used in microwave applications. This low Dk helps to reduce signal loss and improve signal integrity.
– The dissipation factor (Df) of the material is 0.0009 at 10 GHz, which is also relatively low. This low Df helps to minimize signal loss and distortion.
– The Rogers 5880 laminate has a thickness of 0.020″ (0.508 mm) and a copper foil thickness of 1 oz/ft2 (0.035 mm).
– The material is designed to operate over a wide temperature range, from -55°C to +125°C.
– The datasheet includes information on the mechanical properties of the material, such as its tensile strength, flexural strength, and impact strength.
– The datasheet also provides information on the electrical properties of the material, such as its dielectric breakdown voltage and surface resistivity.
– The Rogers 5880 laminate is RoHS compliant, meaning that it does not contain certain hazardous substances that are restricted by the European Union’s Restriction of Hazardous Substances (RoHS) directive.

Aluminum pcb with Insulation hole

Overall, the Rogers 5880 datasheet provides a comprehensive overview of the material properties of the Rogers 5880 laminate,

which can be useful for engineers and designers working on high-frequency applications.

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