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Explore innovative strategies to enhance productivity in electronics manufacturing through custom PCB assembly techniques. Discover how tailored designs and optimized processes can drive efficiency and elevate the performance of your projects.
This article explores essential guidelines for achieving excellent PCB design, emphasizing best practices that lead to efficient layouts, reliable performance, and manufacturability—offering insights for both beginners and experienced designers alike.
This article explores cutting-edge strategies for enhancing prototype assembly services, focusing on efficiency, cost-effectiveness, and quality. It highlights technologies and methodologies that streamline processes and improve outcomes in product development.
Explore the leading global PCB manufacturers revolutionizing the electronics industry today. Discover how these innovative companies shape the market with their diverse PCB solutions, addressing various applications and advancing technology.
In PCB reverse technology research, reverse deduction of schematic diagram refers to the reverse deduction of PCB circuit diagram based on PCB file diagram or direct drawing of PCB circuit diagram based on the actual product, aiming to explain the principle and working condition of the circuit board. In addition, this circuit diagram is also…
At present, electronic equipment used in various electronic equipment and systems still uses printed circuit boards as the main assembly method. Practice has proved that even if the circuit schematic is designed correctly, improper printed circuit board design will have an adverse effect on the reliability of electronic equipment. For example, if two thin parallel…
Standardization of PCB Connectors Abstract: The specification parameters of wires can be easily obtained from various materials, but how to use these parameters to calculate the resistance of PCB connectors? This article will introduce the relationship between wire specifications and PCB connector size, as well as the functional relationship between resistance and size and temperature…
1.Acceptability, acceptance The former refers to the various operating conditions and written criteria that should be followed when inspecting semi-finished or finished products. The latter refers to the process of performing acceptance inspection, such as Acceptance Test. 2.Acceptable Quality Level (AQL) Acceptable Quality LevelIt refers to the “upper limit of defective rate” that the inspected…
Technical measures to improve the reliability of PCB equipment: scheme selection, circuit design, circuit board design, structural design, component selection, manufacturing process and other aspects. The specific measures are as follows: (1) Simplify scheme design. When designing the scheme, under the premise of ensuring that the equipment meets the technical and performance indicators, the design…
The chip on board (COB) process first covers the silicon wafer placement point on the substrate surface with thermal conductive epoxy resin (generally epoxy resin doped with silver particles), then directly places the silicon wafer on the substrate surface, heat treats until the silicon wafer is firmly fixed on the substrate, and then uses wire…
In a single in-line package (SIP), the pins are led out from one side of the package and arranged in a straight line. Usually, they are through-hole type, and the pins are inserted into the metal holes of the printed circuit board. When assembled on the printed circuit board, the package is sideways. A variation…
Dry film solder mask is not in liquid or paste form, it appears in the form of a photosensitive polymer film, which is sandwiched between two protective layers. These two protective layers protect the middle photosensitive emulsion film to prevent it from being damaged during operation. The steps for applying dry film solder mask are…
Most of the design performance of multi-substrates is similar to that of single or dual substrates, that is, to avoid cramming too many circuits into too small a space, which results in unrealistic tolerances, high inner layer capacitance, and even possible safety compromises to product quality. Therefore, performance specifications should consider a complete evaluation of…
The ability to control machines with thoughts is a long-standing dream; especially for those who are paralyzed. In recent years, technological advances have accelerated the progress of brain-machine interfaces (BMI). For biomedical applications, Duke University researchers have successfully developed ASICs for signal processing and electronic circuit systems for wireless transmission of power and information using…
The situation involving moisture sensitivity of plastic integrated circuits (ICs) has been steadily getting worse, due to a number of industry trends, including the continued pursuit of higher reliability products to support critical communications and technology applications. Failure rates for moisture-sensitive devices (MSDs) alone are already at an intolerable level, coupled with the ongoing changes…