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Detection Circuit in PCB Reverse Design System 1 Introduction When electronic engineers are performing reverse design or repair work on electronic equipment, they first need to understand the connection relationship between the components on the unknown printed circuit board (PCB), so they need to measure and record the connectivity relationship between the pins of each…
Introduction High-speed PCB crosstalk analysis and minimization 1.Introduction With the increasing complexity and performance of electronic products, the density of printed circuit boards and the frequency of related devices are constantly rising. Maintaining and improving the speed and performance of the system has become an important issue for designers. The higher the signal frequency, the…
Via is one of the important components of multi-layer PCBs. The cost of drilling holes usually accounts for 30% to 40% of the cost of PCB board manufacturing. Simply put, every hole on a PCB can be called a via. From the perspective of function, vias can be divided into two categories: One is used…
How to reduce the mutual interference between digital signals and analog signals? Before designing, we must understand the two basic principles of electromagnetic compatibility (EMC): the first principle is to reduce the area of the current loop as much as possible; the second principle is that the system uses only one reference plane. On the…
How to reduce the mutual interference between digital signals and analog signals? Before designing, we must understand the two basic principles of electromagnetic compatibility (EMC): the first principle is to reduce the area of the current loop as much as possible; the second principle is that the system uses only one reference plane. On the…
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The arrangement of components on PCB should follow certain rules. (1) Components should be installed in the best position for natural heat dissipation to make the heat transfer path as short as possible. Components on the same PCB should be arranged according to their heat generation and heat dissipation degree as much as possible. Components…
Using different resin systems and material substrates, different resin systems will lead to obvious differences in the activation effect and copper plating during copper plating. In particular, some CEM composite substrates and high-frequency silver substrates are specific. When doing chemical copper plating, some special methods need to be taken to treat them. If normal chemical…
Regarding “via window” and “via cover oil” (the difference between the usage of PAD and VIA), many customers and design engineers often ask what this means when placing orders in the system, and which option should I choose for my file? The following is an explanation of this problem: I often encounter such problems. The…
For many years, the volatile PCB prices have been familiar to people inside and outside the industry. Even some people with many years of PCB experience may not fully understand the ins and outs of this. Let’s analyze the main factors affecting PCB prices: 1.The different materials used in PCBs cause price diversity Take ordinary…
This article mainly introduces the EMC design principles for high-speed PCBs. First, it introduces the basic EMC knowledge of PCB design, then explains the importance of EMC design in PCB and related items of EMC design in PCB, and finally introduces in detail the 47 principles of EMC design for high-speed PCBs. Let’s follow the…
Introduction to tin spraying process: Tin spraying is also called hot air leveling. Through physical action, the printed circuit board is immersed in molten solder, and then the excess solder on the surface of the printed circuit board and in the metallized holes is blown off by hot air, thereby obtaining a smooth and bright…