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Implementation of conductive hole plugging process
ByGrace January 21, 2025January 20, 2025
For surface mount boards, especially BGA and IC mounting, the via plugging requirements must be flat, with a convex and concave of plus or minus 1mil, and the via edge must not be red and tinned; the via hole must not have tin beads. In order to meet customer requirements, the via plugging process can…
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PCB stacking design
ByGrace January 21, 2025January 20, 2025
In general, stacking design mainly follows two rules: 1.Each routing layer must have an adjacent reference layer (power or ground layer); 2. The adjacent main power layer and ground layer must maintain a minimum spacing to provide a larger coupling capacitor; The following lists the stacking from two-layer boards to ten-layer boards: 3.Stacking of single-sided…
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Why is “serial” so popular?
ByGrace January 21, 2025January 20, 2025
In the past two years, the word that everyone has heard the most is probably serial transmission. From the perspective of technological development, serial transmission has the momentum to completely replace parallel transmission. USB replaces IEEE 1284, SATA replaces PATA, and PCI Express replaces PCI. In principle, parallel transmission is actually better than serial transmission….
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Copper clad laminate
ByGrace January 21, 2025January 20, 2025
In addition to supporting various components in PCB boards, copper clad laminates can also achieve electrical connections or electrical insulation between them. 1.Classification of copper clad laminates Copper clad laminates are composed of three parts: copper foil, reinforcement material, and adhesive. Boards are usually classified according to the type of reinforcement material and adhesive type…
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Why do circuit boards need copper cladding?
ByGrace January 21, 2025January 20, 2025
Generally, there are several reasons for copper cladding. 1.EMC. For large-area ground or power copper cladding It will play a shielding role. Some special grounds, such as PGND, play a protective role. 2.PCB process requirements. Generally, in order to ensure the electroplating effect or lamination deformation, copper is laid on PCB layers with less wiring….
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Improved circuit board welding to cause false soldering
ByGrace January 21, 2025January 20, 2025
1 Surface tension The cohesive force of tin-lead solder is even greater than that of water, making the solder spherical to minimize its surface area (under the same volume, the sphere has the smallest surface area compared to other geometric shapes to meet the requirements of the lowest energy state). The effect of flux is…
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PCB Assembly | pwb assembly
Streamlining PWB Assembly Processes to Boost Production Outcomes
ByAndwin Circuits January 20, 2025
This article explores innovative strategies for streamlining PWB assembly processes, highlighting techniques to enhance efficiency and productivity, ultimately leading to improved production outcomes in electronics manufacturing.
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PCB Technology Guide PCB Wiring Process Requirements
ByGrace January 20, 2025January 17, 2025
1 Line Generally, the signal line width is 0.3mm (12mil), and the power line width is 0.77mm (30mil) or 1.27mm (50mil); the distance between lines and between lines and pads is greater than or equal to 0.33mm (13mil). In practical applications, the distance should be increased when conditions permit;When the wiring density is high, it…
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PCB Design Specifications for LED Switching Power Supply
ByGrace January 20, 2025January 17, 2025
In any switching power supply design, the physical design of the PCB board is the last link. If the design method is not appropriate, the PCB may radiate too much electromagnetic interference, causing the power supply to work unstably. The following is an analysis of the matters that need to be paid attention to in…
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PCB Assembly | pcb assembly cost per component
Cost Analysis of PCB Assembly for Individual Components
ByAndwin Circuits January 20, 2025
This article provides an in-depth cost analysis of PCB assembly focused on individual components, exploring factors that influence pricing, and offering insights to optimize budget considerations for manufacturing.
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What are some ways to speed up PCB production time?
ByGrace January 20, 2025January 18, 2025
Most of today’s mass-produced electronic hardware is manufactured using surface mount technology, or SMT. In addition to offering many other advantages, SMT PCBs go a long way in speeding up PCB production time. As we all know, Jieduobang’s expedited service and board delivery period are very fast, so we have a very big advantage in…
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LTE Cat 1-the new favorite in the era of the Internet of Things
ByGrace January 20, 2025January 20, 2025
With NB-IoT reaching 50 million shipments this year and expected to reach 100 million next year, it has risen rapidly. A medium-speed (including 3G, Cat.1, eMTC (catm)) market between high-speed (5G and 4G LTE) and low-speed (2G GPRS and NB-IoT) is emerging. The time for LTE Cat 1 to take on the main role of…
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Explanation of PCB Immersion Gold Process
ByGrace January 20, 2025January 18, 2025
1.What is Immersion Gold? Simply put, Immersion Gold is a method of chemical deposition that produces a metal coating on the surface of the circuit board through a chemical oxidation-reduction reaction. 2.Why do we need Immersion Gold? The copper on the circuit board is mainly red copper. The copper solder joints are easily oxidized in…
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PCB heat dissipation tips
ByGrace January 20, 2025January 20, 2025
The heat generated by electronic equipment during operation causes the internal temperature of the equipment to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up, the device will fail due to overheating, and the reliability of the electronic equipment will decrease. Therefore, it is very important to…
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Will the impedance mutation of a small section of the link affect the signal quality?
ByGrace January 20, 2025January 18, 2025
When designing PCB, I believe that experienced engineers have encountered this situation. During the wiring process, sometimes due to circuit structure or space limitations, a certain section of the line needs to be thicker or thinner, such as series resistors and capacitors, lower holes, BGA outlet areas or densely populated areas, etc., but the result…
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aluminum pcb

Implementation of conductive hole plugging process

PCB stacking design

Why is “serial” so popular?

Copper clad laminate

Why do circuit boards need copper cladding?

Improved circuit board welding to cause false soldering

Streamlining PWB Assembly Processes to Boost Production Outcomes

PCB Technology Guide PCB Wiring Process Requirements

PCB Design Specifications for LED Switching Power Supply

Cost Analysis of PCB Assembly for Individual Components

What are some ways to speed up PCB production time?

LTE Cat 1-the new favorite in the era of the Internet of Things

Explanation of PCB Immersion Gold Process

PCB heat dissipation tips

Will the impedance mutation of a small section of the link affect the signal quality?

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