High-Speed and High-Density PCB: Challenges and Solutions for Radiated Emissions
Abstract This paper examines the growing challenges of radiated emissions (RE) in high-speed, high-density printed circuit boards (PCBs) that are fundamental to modern electronics. As signal speeds exceed GHz frequencies and component densities reach unprecedented levels, traditional PCB design approaches struggle to contain electromagnetic interference (EMI). This article analyzes the root causes of RE in…














