TC600™ Laminates
TC600™ woven fiberglass reinforced, ceramic filled, PTFE-based compositefor use as a printed circuit board substrate is designed to provide enhancedheat-transfer through “Best-In-Class” thermal conductivity, while reducingdielectric loss and insertion loss. Lower losses result in higher Amplifier andAntenna Gains/Efficiencies. Mechanical robustness is also greatly improvedfor the 6.15 dielectric constant market. The increased thermal conductivity of TC600…

